Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board Dk3.0 Df 0.001 Microwave PCB

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3003
• Model NO.: BIC-143-V1.43
• Material: PTFE
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Foil External: 1 Oz
• Final Height of PCB: 0.3 mm ±0.1
• Legend Color: White
• Minimum Trace and Space: 5mil/5mil
• Minimum / Maximum Holes: 0.3mm/0.8mm
• Contour/Cutting: Routing
• Flamibility Rating: UL 94-V0 Approval Min.
• Transport Package: Vacuum
• Specification: 100 x 100mm=1PCS
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534001000
• Production Capacity: 50000PCS/Month

Product Description

Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.  The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/ºC. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/ºC, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers

PCB Specifications

Rogers RO3003 10mil 0.254mm High Frequency PCB DK3.0 RF PCB for Automotive Radar Applications
PCB SIZE	100 x 100mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	NO
Through Hole Components	NO
LAYER STACKUP	copper ------- 35 um(1 oz)
	RO3003 0.254mm
	copper ------- 35 um(1 oz)
TECHNOLOGY
Minimum Trace and Space:	5mil / 5mil
Minimum / Maximum Holes:	0.3mm / 0.8mm
Number of Different Holes:	N/A
Number of Drill Holes:	N/A
Number of Milled Slots:	N/A
Number of Internal Cutouts:	N/A
Impedance Control:	N/A
Number of Gold finger:	N/A
BOARD MATERIAL
Glass Epoxy:	RO3003 0.254mm
Final foil external:	1oz
Final foil internal:	N/A
Final height of PCB:	0.3 mm ±0.1
PLATING AND COATING
Surface Finish	N/A
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	N/A
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	N/A
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
Property	RO3003	Direction	Units	Condition	Test Method
Electrical Properties
Dielectric Constant,εProcess	3.0±0.04	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.001	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-3	Z	ppm/ºC	10 GHz -50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	10^7		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^7		MΩ	COND A	IPC 2.5.17.1
Thermal Properties
Td	500		ºC TGA		ASTM D 3850
Coefficient of Thermal Expansion (-55 to 288ºC)	17 16 25	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.4.1
Thermal Conductivity	0.5		W/M/K	50ºC	ASTM D 5470
Mechanical Properties
Copper Peel Stength	12.7		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Young's Modulus	930 823	X Y	MPa	23ºC	ASTM D 638
Dimensional Stability	-0.06 0.07	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Physical Properties
Flammability	V-0				UL 94
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Density	2.1		gm/cm^3	23ºC	ASTM D 792
Specific Heat	0.9		j/g/k		Calculated
Lead-free Process Compatible	Yes