Rogers Rt/Duroid 5870 20mil 0.508mm High Frequency PCB Double Sied RF PCB for Millimeter Wave Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 5870
• Model NO.: BIC1241R4.1
• Material: Fiberglass Epoxy
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Finish: Immersion Gold
• Board Thick: 0.6mm+_0.1
• Minimum / Maximum Holes: 0.3mil/4.6 Mil
• Via: Pth
• Test: 100% Electrical Test Prior Shipment
• Dimension Tolerance: UL 94-V0 Approval Min
• Contour/Cutting: Routing
• Final Foil External: 1.0 Oz
• Transport Package: Vacuum
• Specification: 99 x 65mm=1PCS
• Trademark: bicheng enterprise limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 PCS/ Month

Product Description

Rogers RT/Duroid 5870 20mil 0.508mm High Frequency PCB Double Sied RF PCB for Millimeter Wave Applications
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RT/duroid 5870 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5870 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 to Ku-band and above. RT/duroid 5870 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

The typical applications are commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems and point to point digital radio antennas etc.


PCB Specifications

RT/Duroid 5870 20mil 0.508mm High Frequency PCB Double Sied RF PCB for Millimeter Wave Applications
PCB SIZE	99 x 65mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1 oz)+plate TOP layer
	RT/duroid 5870 0.508mm
	copper ------- 35um(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5 mil / 4.5 mil
Minimum / Maximum Holes:	0.3 mm / 4.6 mm
Number of Different Holes:	7
Number of Drill Holes:	105
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RT/duroid 5870 0.508mm
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	0.6 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	n/a
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Rogers RT/duroid 5870

RT/duroid 5870 Typical Value
Property	RT/duroid 5870		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.33 2.33±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.33		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0005 0.0012		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-115		Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 10^7		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	2 x 10^7		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23)		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23ºC	Test at 100ºC	N/A	MPa(kpsi)	A	ASTM D 638
	1300(189)	490(71)	X
	1280(185)	430(63)	Y
Ultimate Stress	50(7.3)	34(4.8)	X
	42(6.1)	34(4.8)	Y
Ultimate Strain	9.8	8.7	X	%
	9.8	8.6	Y
Compressive Modulus	1210(176)	680(99)	X	MPa(kpsi)	A	ASTM D 695
	1360(198)	860(125)	Y
	803(120)	520(76)	Z
Ultimate Stress	30(4.4)	23(3.4)	X
	37(5.3)	25(3.7)	Y
	54(7.8)	37(5.3)	Z
Ultimate Strain	4	4.3	X	%
	3.3	3.3	Y
	8.7	8.5	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.22		Z	W/m/k	80ºC	ASTM C 518
Coefficient of Thermal Expansion	22 28 173		X Y Z	ppm/ºC	0-100ºC	IPC-TM-650 2.4.41
Td	500		N/A	ºC TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm^3	N/A	ASTM D 792
Copper Peel	27.2(4.8)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A