FR-4 High Tg170 8 Layer Black Gold PCB with Immersion Gold for 10 pcb per panel
in Remote Control
Commodity Introduction
This is a type of FR-4 PCB for the application of Remote Control. It's an 8 layer board at 1.6mm
thick.The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per
IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Parameters & Data Sheet
| Item |
Requirement |
Result |
| Laminate |
Type |
FR-4 Tg170 |
FR-4 TG170 |
| Supplier |
ITEQ |
ITEQ |
| Board thickness |
1.6+/-10%mm |
1.64-1.65mm |
| Outer copper foil |
>=35 um |
44.31um |
| Inner copper foil |
H/H OZ |
H/H OZ |
| Warp-twist |
<= 0.75% |
0.24% |
| Legend |
Type |
Taiyo IJR-4000 MW300 |
Taiyo IJR-4000 MW300 |
| Color |
White |
White |
| Location |
CS & SS |
CS & SS |
| Marking |
Co.logo |
As requirement |
OK |
| UL.logo |
As requirement |
OK |
| Date code |
As requirement |
OK |
| Marking form |
As requirement |
OK |
| Location |
CS |
CS |
| Min line width (mil) |
6 |
6.2 |
| Min line spacing (mil) |
4.5 |
4.3 |
| Min ring width (mil) |
NA |
NA |
| Solder Mask |
Type |
KSM-S6189BK31 |
KSM-S6189BK31 |
| Color |
Black |
Black |
| Thickness |
>=10 um |
13 um |
| Pencil Test |
6H OR ABOVE |
OK |
| SOLVENT TEST |
NO ATTACK |
OK |
| TAPE TEST |
NO PEEL OFF |
OK |
| Surface Treament |
Immersion Gold |
OK |
| Special Treament |
Silk screen |
/ |
/ |
| Location |
/ |
/ |
| Forming |
V-cut |
OK |
| Normal Testing |
Electrical test |
100% PCB passed |
OK |
| Visual inspection |
IPC-A-600H&IPC-6012C |
OK |
| Solderability Test |
245ºC 5S 1 Cyclec |
OK |
Finished dimension (unit: mm): including v-cut
| No |
Required Dimension (tolerance) |
Actual Dimension |
| 1 |
100.00 |
99.88 |
100.08 |
99.98 |
99.93 |
| 2 |
23.00 |
22.99 |
22.99 |
22.94 |
23.00 |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
| No |
Required |
PTH |
Actual Dimension |
| 1 |
0.750 |
Y |
0.750 |
0.725 |
0.775 |
| 2 |
1.000 |
Y |
1.000 |
0.975 |
1.025 |
| 3 |
0.700 |
N |
0.700 |
0.675 |
0.725 |
| 4 |
2.000 |
N |
2.000 |
1.975 |
2.025 |
| 5 |
4.000 |
N |
4.000 |
3.975 |
4.025 |
Learn PCB and Buy PCB
Glass Transition Temperature (Tg)
The thermal properties of the resin system are characterized by the glass transition temperature
(Tg), which always is expressed in °C. The most commonly used property is the thermal
expansion. When measuring theexpansion versus the temperature, we can get a curve as shown
in following picture.The Tg is determined by the intersection of the tangents of the flat and steep
parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and
glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.
For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature
is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily
exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The
expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg.
This implies a certain risk of wall cracking in plated-through holes, and the more resin around the
hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between
epoxy and copper is only three times, so here the risk of cracking is negligible.
Audited Supplier 
){kind=link}