| Customization: | Available |
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| Type: | Rigid-Flexible PCB |
| Dielectric: | 50 µm Polyimide |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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(FPC's are custom-made products, the picture and parameters shown are just for reference)
Introducing Our 10-Layer Rigid-Flex PCB for Telemetry Systems
We are excited to present our advanced 10-layer rigid-flex printed circuit board (PCB), meticulously designed for telemetry systems. This PCB features a robust construction that combines a high-Tg FR-4 rigid board with a 50μm polyimide flexible board, ensuring excellent performance in high-density environments and complex mechanical scenarios.
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Data sheet
| Size of Flexible PCB | 153.25 X 87.66mm |
| Number of Layers | 10 layers |
| Board Type | Rigid flex PCB |
| Board Thickness | 1.6mm |
| Board Material | 1.6mm FR-4 / 0.2mm Polyimide |
| Board Material Supplier | Rigid (Shengyi) | Flex (Panasonic) |
| Tg Value of Board Material | 170ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 35/18 µm |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Yellow coverlay / Matt Black solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | N/A |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Special Process Requirements
1.Process Edge Design:
The width of the process edge is tailored to customer specifications, with designated text silk-screened on the outer edge. Breakaway holes are included based on customer requirements.
2.Countersink Hole Processing:
Countersink holes are positioned according to customer design documents, adhering to IPC-6012 standards for diameter and countersink angle.
3.Serial Number Printing:
Unique serial numbers are printed in the format of Week/Year + Serial Number (e.g., 12/2025-01), with automatic incremental coding supported.
4.Alternative Scheme for Prepreg (PP) Layer:
The PCB includes three layers of prepreg material strategically placed between selected layers for enhanced performance.
Product Advantages
High Reliability: The combination of high-Tg FR-4 and the ENIG process makes this PCB suitable for high-temperature soldering and harsh operating environments.
Rigid-Flex Design: The flexible polyimide area supports dynamic bending, withstanding over 100,000 bending cycles, while the rigid areas provide essential mechanical support.
Precise Identification: The matte black solder mask with white characters balances aesthetics with functionality, while the serial number traceability system enhances quality control efficiency.
Flexible Adaptability: Supports alternative PP layer materials to optimize cost and performance based on specific project requirements.
Delivery Instructions
We are committed to delivering high-quality PCBs on time to meet your project needs. For more information or to discuss your requirements, please reach out to us!
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