Premium RO3006 Double-Sided PCB – 0.76mm Thin Profile, 9/8 Mil Precision, Enig Finish for High-Frequency Systems

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3006
• Model NO.: BIC-1020-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Premium RO3006 Double-Sided PCB - 0.76mm Thin Profile, 9/8 mil Precision, ENIG Finish for High-Frequency Systems
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. High-Performance RF Circuit Board Overview
This advanced double-layer PCB utilizes Rogers RO3006 high-frequency laminate to deliver unmatched signal integrity and thermal management for demanding wireless applications. Designed for automotive radar (77GHz+), satellite communications, and 5G infrastructure, this ultra-thin circuit board combines ceramic-reinforced PTFE technology with exceptional electrical stability across wide temperature ranges.

Critical Advantages:
Superior Signal Fidelity: Stable dielectric constant (6.15±0.15) with ultra-low loss (0.002 @ 10GHz)
Thermal Resilience: Maintains performance from -55°C to +288°C with matched CTE to copper (17/17/24 ppm/°C)
High-Frequency Capability: Optimized for mmWave applications up to 77GHz and beyond
Robust Construction: 0.02% moisture absorption ensures reliability in harsh environments
Cost-Effective Production: Compatible with high-volume manufacturing processes

2. Detailed Technical Specifications

Characteristic	Precision Specification
Core Material	Rogers RO3006 ceramic-PTFE composite
Board Architecture	Dual-layer configuration
Physical Dimensions	217mm × 102mm (±0.15mm tolerance)
Profile Thickness	0.76mm (25mil dielectric core)
Conductive Layers	35μm electrodeposited copper (1oz)
Circuit Precision	9/8 mil trace/space capability
Microvia Technology	0.3mm minimum laser drill diameter
Surface Finish	Electroless Nickel Immersion Gold
Visual Identification	Blue solder mask with white silkscreen
Quality Validation	100% electrical continuity testing
Thermal Performance	0.79 W/mK conductivity rating

3. Engineering Excellence & Applications
Breakthrough Material Properties

The RO3006 substrate delivers:
Unparalleled Dk stability across operational extremes
Exceptional thermal decomposition resistance (>500°C)
Minimal Z-axis expansion for reliable plated through-holes
Superior thermal conductivity for power dissipation

Optimized Circuit Design
Component Integration: Accommodates 51 components with 80 total contact points (59 PTH, 21 SMT)
Interconnect Solution: 75 precision vias across 7 signal networks
RF-Optimized Surface: Blue solder mask minimizes high-frequency interference
Manufacturing Ready: Accepts industry-standard Gerber RS-274-X files


Target Implementations
Advanced Automotive Systems: Next-gen radar, V2X communication modules
Aerospace Electronics: Satellite antennas, avionics systems
Telecommunications: 5G mmWave infrastructure, base station amplifiers
Industrial IoT: Smart grid equipment, remote monitoring devices

Competitive Differentiation
Frequency-Perfect Construction: ENIG finish ensures reliable connectivity while preserving RF characteristics
Thermal Management: Ceramic-infused composition effectively dissipates thermal loads
Production Efficiency: Combines PTFE performance with cost-effective fabrication
Quality Assurance: Tight Dk tolerance (±0.15) guarantees electrical consistency

Engineered for Tomorrow's Wireless Challenges
Our technical team stands ready to support your design requirements or provide immediate quotations for prototype and production orders. This solution represents the ideal choice for applications demanding uncompromised performance at millimeter-wave frequencies and extreme environmental conditions.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.