High-Frequency 2-Layer RO4350b PCB – 1.6mm Thick, 6/6 Mil Trace/Space, Enig Finish for RF & Automotive Radar Systems

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4350b
• Model NO.: BIC-1017-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency Double-Sided RO4350B PCB - 1.6mm Thick, 6/6 mil Trace/Space, ENIG Finish for RF & Automotive Radar Systems
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Overview of This PCB
Engineered for high-frequency RF and microwave systems, this double-sided PCB leverages Rogers RO4350B laminate to deliver unmatched electrical performance, thermal stability, and cost efficiency. Ideal for 5G infrastructure, automotive radar, satellite communications, and IoT devices, it merges the low-loss benefits of advanced materials with the manufacturability of standard FR-4 processes. Certified to IPC-Class-2 standards and UL 94 V-0 flammability rated, this PCB guarantees reliability in high-power and extreme environments.

Key advantages include:
Ultra-Low Signal Loss: Dielectric constant of 3.48 ±0.05 @ 10 GHz and dissipation factor of 0.0037 @ 10 GHz for precision in RF applications.
Thermal Durability: Operates across -40°C to +85°C with a glass transition temperature (Tg >280°C) for harsh-environment resilience.
Simplified Production: Compatible with standard epoxy/glass processes, reducing costs compared to PTFE-based alternatives.
Global Scalability: Prototyping and mass production supported worldwide.


2. PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	Rogers RO4350B laminate
Layer Count	Double-sided
Board Thickness	1.6mm
Dielectric Core	60mil (1.524mm) RO4350B substrate
Copper Layers	17µm base + 17µm plating (34µm total)
Trace/Space	6/6 mils
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Solder Mask	No
Silkscreen	No
Flammability Rating	UL 94 V-0
Quality Compliance	IPC-Class-2

3. Other Key Components & Features
Stackup Structure
Top/Bottom Layers: 17µm base copper + 17µm plating for enhanced conductivity.
Dielectric Core: 60mil RO4350B substrate ensures stable impedance and thermal management (0.69 W/m/°K).

Design & Manufacturing Specifications
Component Support: 50 components, 73 pads (26 thru-hole, 47 top SMT), 71 vias, and 9 nets.
Artwork Compatibility: Gerber RS-274-X files accepted for seamless fabrication.

Material Advantages
Low CTE: Thermal expansion coefficients (X/Y/Z: 10/12/32 ppm/°C) minimize mechanical stress.
Flame Resistance: UL 94 V-0 rated for high-power RF safety.
Optimized Layout: No solder mask or silkscreen reduces parasitic effects, ideal for dense RF circuits.


Typical Applications
Telecom Infrastructure: 5G base station antennas, power amplifiers.
Automotive Electronics: Radar, LiDAR, ADAS sensors.
Satellite Systems: LNB modules for direct broadcast satellites.
Industrial IoT: RFID tags, high-frequency sensors.

Why Choose This PCB?
High-Frequency Precision: ENIG finish ensures reliable solderability, while 6/6 mils trace/space supports fine-pitch designs.
Robust Construction: 1.6mm thickness and RO4350B core provide mechanical stability.
Cost-Effective Scaling: Streamlined design and global availability enable high-volume production.


Order Now for Reliable High-Frequency Performance!
Contact us to customize your design or request a quote for fast global delivery. Ideal for engineers prioritizing signal integrity in RF and microwave systems.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.