High-Power RF-35tc Double-Sided PCB – 0.8mm 30mil Thickness with HASL Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RF-35tc
• Model NO.: BIC-1016-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Power RF-35TC Double-Sided PCB - 0.8mm Thickness with HASL Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This high-performance double-sided PCB utilizes RF-35TC material, a PTFE-based ceramic-filled substrate engineered for demanding RF power applications. Designed for filters, couplers, and power amplifiers, this 0.8mm thick board delivers exceptional thermal management with 0.92 W/m/K conductivity (1oz copper) while maintaining ultra-low signal loss (0.002 dissipation factor at 10GHz).

The board features:
High-power capability: Optimized for power amplifier applications
Thermal efficiency: Effectively dissipates heat from active components
Stable performance: Maintains consistent Dk (3.5±0.05) across temperature ranges
Cost-effective surface finish: HASL with white top silkscreen

2. PCB Construction Details

Specification	Detail
Base Material	RF-35TC (PTFE ceramic-filled)
Layer Count	Double-Sided
Dimensions	110mm × 92mm (±0.15mm)
Thickness	0.8mm (30mil dielectric)
Copper Weight	1oz (35μm)
Min Trace/Space	5/5 mils
Min Hole Size	0.35mm
Via Count	104
Surface Finish	HASL
Solder Mask	Green (Top only)
Thermal Conductivity	0.92 W/m/K (1oz copper)
Quality Standard	IPC-Class-2

3. Technical Features & Applications
Advanced Material Properties
Ultra-low loss: 0.002 dissipation factor at 10GHz
Thermal stability: CTE matched to copper (11/13 ppm/°C X/Y)
Moisture resistant: Only 0.05% absorption
High Tg: Decomposition temperature of 436°C

Board Configuration
Component density: 35 components (61 thru-hole, 37 SMT)
Interconnect solution: 104 vias for complex routing
Thermal management: Optimized for power components
File format: Gerber RS-274-X

Typical Applications
RF Power Systems: High-power amplifiers and transmitters
Satellite Communications: Antennas and LNBs
5G Infrastructure: Base station filters and couplers
Defense Electronics: Radar and communication systems

Why Choose This PCB?
1. Industry-leading thermal performance for power applications
2. Exceptional signal integrity with ultra-low loss characteristics
3. Reliable HASL finish with cost-effective manufacturability
4. Stable dielectric properties across temperature variations

Order Now for Reliable High-Frequency Performance!
Contact us to customize your design or request a quote for fast global delivery. Ideal for engineers prioritizing signal integrity in RF and microwave systems.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.