Ultra-Thin RO4003c Double-Sided PCB – 0.6mm 20mil with Enig Finish for High-Frequency Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c PCB
• Model NO.: BIC-1013-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Ultra-Thin RO4003C Double-Sided PCB - 0.6mm with ENIG Finish for High-Frequency Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Product Overview
This advanced double-sided PCB utilizes Rogers RO4003C high-frequency laminate to deliver exceptional RF performance in an ultra-thin 0.6mm profile. Designed for demanding wireless applications, the board features 1.5 oz copper layers (52μm) and ENIG surface finish, providing superior signal integrity and durability. With 4/4 mil trace/space capability and resin-filled vias (IPC-4761 Type VII), this PCB is ideal for compact, high-performance designs in 5G, automotive, and satellite communications.

2. PCB Construction Details

Specification	Detail
Base Material	Rogers RO4003C
Layer Count	Double-Sided
Dimensions	136mm x 96mm (5 types, 5-up panel)
Thickness	0.6mm
Min Trace/Space	4/4 mils
Min Hole Size	0.2mm
Copper Weight	1.5 oz (52μm)
Via Treatment	0.2mm & 0.5mm resin-filled
Surface Finish	ENIG
Solder Mask	Green (Top & Bottom)
Dielectric Thickness	20mil
Quality Standard	IPC-Class-2

3. Key Features & Applications
Technical Highlights
Enhanced Current Capacity: 1.5 oz copper layers for power applications
Precision Manufacturing: 4/4 mil trace/space for high-density designs
Reliable Interconnects: 153 vias with resin filling (IPC-4761 Type VII)
Thermal Management: 0.71 W/m/K conductivity for heat dissipation
Stable Performance: DK 3.38±0.05 with low 0.0027 dissipation factor

Board Configuration
Component Support: 96 components (54 thru-hole, 72 SMT)
Panel Design: 5 different designs across 5 panels
Plated Slots: Defined by side-by-side holes in Gerber files
File Format: Gerber RS-274-X for manufacturing


Ideal Applications
5G Infrastructure: Small cell antennas and power amplifiers
Automotive Radar: Collision avoidance and ADAS systems
Satellite TV: LNB modules for broadcast reception
RFID Systems: High-frequency identification tags

Why This PCB Stands Out
1. Ultra-Thin Profile: 0.6mm thickness for space-constrained designs
2. High-Frequency Optimized: Excellent signal integrity up to 10GHz
3. Robust Construction: Resin-filled vias and plated slots enhance durability
4. Cost-Effective: Processes like FR-4 with superior RF performance



Thank you for your reading and you're welcome to contact us for your PCB enquiries.