6-Layer Hybrid RO4003c/Fr-4 PCB – 1.1mm Thickness with Enig Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1014-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

6-Layer Hybrid RO4003C/FR-4 PCB - 1.1mm Thickness with ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This advanced 6-layer hybrid PCB combines Rogers RO4003C high-frequency material with standard FR-4 to deliver optimal RF performance and cost efficiency. Designed for demanding wireless applications, the board features a 1.1mm thickness with impedance-controlled 50Ω traces (20mil single-ended) and ENIG surface finish for reliable signal transmission.

The hybrid construction provides:
Superior RF performance in critical layers
Cost-effective FR-4 for internal layers
Precise 4/4 mil trace/space capability
Resin-filled microvias (0.2mm & 0.25mm) for enhanced reliability

2. PCB Construction Details

Specification	Detail
Materials	RO4003C + FR-4 Hybrid
Layer Count	6 Layers
Dimensions	76mm x 76mm (±0.15mm)
Thickness	1.1mm
Trace/Space	4/4 mils
Min Hole Size	0.2mm
Copper Weight	1 oz (35μm) all layers
Via Treatment	0.2mm & 0.25mm resin-filled
Surface Finish	ENIG
Solder Mask	Matte Blue (Top & Bottom)
Silkscreen	White (Top only)
Impedance Control	50Ω (Top layer 20mil single-ended)
Quality Standard	IPC-Class-2

3. Technical Features & Benefits
Stackup Configuration
Top Layer: 35μm copper (RO4003C dielectric)
Ground Plane: Solid copper layer
Internal Signal Layers: 3 routing layers with FR-4 prepreg
Bottom Layer: 35μm copper (RO4003C dielectric)

Key Advantages
Hybrid Design: Combines RO4003C's RF performance with FR-4's cost efficiency
Signal Integrity: Tight impedance control (±10%) for critical RF traces
Thermal Management: 0.71 W/m/K conductivity in RF sections
Component Support: 73 components (43 thru-hole, 51 SMT)
Reliable Interconnects: 62 vias with resin filling

Typical Applications
5G Infrastructure: Base station components
Automotive Radar: ADAS and collision avoidance systems
Satellite Communications: LNB modules
RFID Systems: High-frequency identification


Thank you for your reading and you're welcome to contact us for your PCB enquiries.