High-Frequency RO3003 Double-Layer PCB – 1.6mm Thick, 8/8 Mil Trace/Space, Immersion Tin Finish for 5g & Automotive Radar

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3003
• Model NO.: BIC-1019-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency RO3003 Double-Layer PCB - 1.6mm Thick, 8/8 mil Trace/Space, Immersion Tin Finish for 5G & Automotive Radar
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Advanced RF Circuit Board Overview
Engineered for cutting-edge wireless applications, this double-sided PCB utilizes Rogers RO3003 high-frequency laminate to deliver exceptional signal integrity and thermal stability. Designed specifically for 5G infrastructure, automotive radar systems (77GHz), and satellite communications, this circuit board combines ceramic-filled PTFE technology with superior electrical performance.

Key Advantages:
Ultra-Low Signal Loss: Dielectric constant of 3.00±0.04 with dissipation factor of 0.001 at 10GHz ensures minimal signal degradation
Temperature Resilience: Stable Dk across wide temperature ranges (-55°C to +288°C) with CTE matching copper (X/Y/Z: 17/16/25 ppm/°C)
High-Frequency Optimization: Suitable for applications up to 77GHz including ADAS and mmWave 5G systems
Manufacturing Efficiency: Compatible with volume production processes for cost-effective deployment
Global Compliance: Meets IPC-Class-2 standards with worldwide availability

2. Technical Specifications Summary

Parameter	Specification
Core Material	Rogers RO3003 ceramic-PTFE composite
Board Configuration	Double-layer construction
Dimensions	117mm × 50mm (±0.15mm tolerance)
Thickness	1.6mm (20mil dielectric core)
Conductivity	35μm copper (1oz) on both surfaces
Trace Precision	8/8 mil minimum trace/space
Drilling Capacity	0.4mm minimum hole diameter
Surface Treatment	Immersion tin coating
Quality Assurance	100% electrical testing
Thermal Performance	0.5 W/mK conductivity
Safety Certification	UL 94 V-0 compliant

3. Performance Characteristics & Applications
Superior Material Properties

The RO3003 laminate delivers:
Exceptional Dk stability across frequency and temperature variations
Minimal moisture absorption (0.04%) for reliable operation in humid environments
Thermal decomposition temperature exceeding 500°C
Low Z-axis expansion for reliable plated through holes

Optimized Board Architecture
Component Integration: Supports 77 components with 123 total pads (71 through-hole, 52 SMT)
Interconnect Solution: Features 100 vias across 8 separate nets
Signal Integrity Focus: No solder mask or silkscreen to minimize dielectric interference
Fabrication Ready: Accepts standard Gerber RS-274-X format files


Target Applications
Automotive Electronics: 77GHz radar modules, ADAS sensor arrays
Telecommunications: 5G mmWave base stations, power amplifiers
Satellite Systems: GPS antennas, direct broadcast receivers
IoT Infrastructure: Smart meter backhaul, wireless datalinks

Why This PCB Stands Out
Frequency-Perfected Design: Immersion tin finish ensures excellent solderability while maintaining RF performance
Thermal Management: Ceramic-filled construction effectively dissipates heat in high-power applications
Manufacturing Advantage: Combines PTFE performance with epoxy-glass processing economics
Reliability Assurance: Tight Dk tolerance (±0.04) guarantees consistent electrical properties

Ready for High-Performance RF Solutions?
Contact our engineering team today for design support or request an instant quote for prototype and production quantities. Ideal for applications demanding uncompromising signal fidelity at millimeter-wave frequencies.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.