Thin RO4003c RF PCB - 0.3mm Double-Sided with Enig Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1015-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Thin RO4003C RF PCB - 0.3mm Double-Sided with ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This cutting-edge double-sided PCB utilizes Rogers RO4003C material to deliver exceptional high-frequency performance in an ultra-thin 0.3mm profile. Designed for space-constrained RF applications, the board features 4/4 mil trace/space precision and ENIG surface finish, making it ideal for compact wireless devices and IoT applications.

Key Advantages:
Extremely Thin Profile: Just 0.3mm thick for maximum space savings
High-Frequency Performance: 3.38±0.05 dielectric constant at 10GHz
Precision Manufacturing: 4/4 mil trace/space with 0.2mm microvias
Reliable Surface Finish: ENIG for excellent solderability and corrosion resistance

2. PCB Specifications

Parameter	Specification
Material	Rogers RO4003C
Thickness	0.3mm (8mil dielectric)
Dimensions	61mm × 32mm (±0.15mm)
Copper Weight	1oz (35μm) both layers
Min Trace/Space	4/4 mils
Min Hole Size	0.2mm
Via Count	19
Surface Finish	ENIG
Components Supported	16 (11 thru-hole, 7 SMT)

3. Technical Features
Advanced Material Properties
Ultra-low 0.0027 dissipation factor at 10GHz
Excellent thermal conductivity (0.71 W/m/K)
CTE matched to copper (11/14 ppm/°C X/Y)
Low 0.06% moisture absorption

Design Capabilities
Supports high-density RF layouts
Compatible with automated assembly
100% electrical testing ensures reliability
Gerber RS-274-X file format


Typical Applications
Miniature RF Modules: IoT and wearable devices
5G Small Cells: Compact antenna arrays
Automotive Sensors: Radar and ADAS components
Satellite Comms: Miniaturized LNBs

Why Choose This PCB?
1. Industry's thinnest RO4003C solution
2. Maintains RF performance in tiny form factor
3. Cost-effective alternative to PTFE materials
4. Global manufacturing availability



Thank you for your reading and you're welcome to contact us for your PCB enquiries.