Complete PCB Manufacturing for Power Supply Circuits and Amplificador Systems

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-056-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers RT/Duroid 6002 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Coating Immersion Gold and Immersion Silver.
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,
Today, we talk about the high frequency PCB made on RT/duroid 6002 material.

The RT/ duroid 6002 microwave material is a kind of low loss and low dielectric constant laminate, which can meet the strict requirements for mechanical reliability and electrical stability in complex microwave structural design. The main components are PTFE ceramics composites.

The dielectric constant of RT/duroid 6002 has excellent resistance to temperature change between -55 ºC and 150 ºC, which can meet the requirements of filter, oscillator and delay line application design for its electrical stability.


The main advantages

1. low loss ensures excellent high Frequency performance
2. excellent mechanical and electrical properties, reliable multi-layer board construction.
3. extremely low thermal coefficient of dielectric constant,ensure excellent dimensional stability.
4. in-plane expansion coefficient matched to copper, allows for more reliable surface mounted assemblies.
5. low outgassing, ideal for space applications

Typical applications

1. Phased Array Antennas
2. Round Based and Airborne Radar Systems
3. GPS antennas
4. Power Backplanes
5. Commercial Airline Collision Avoidance

Our PCB Capability (RT/duroid 6002)

PCB Material:	Ceramic-filled PTFE composite
Designation:	RT/duroid 6002
Dielectric constant:	2.94  ±0.04 (process)
	2.94 (design)
Layer count:	2 Layer, Multilayer
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil (0.508mm)
	30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immserion Silver, OSP etc..

The base copper of RT/druoid PCB has 0.5oz, 1oz and 2oz; the thickness of PCB board is wide, ranging from 5mil to 120mil to be considered by our designers.



The basic colour of RT/duroid 6002 PCB is white.

RT/duroid 6002 PCB is very suited to the equipment of flat and non-planar structures, such as antennas, complex multi-layer circuits with inner-layer connections, and microwave circuits for aerospace designs in hostile environments.

If you have any questions, please feel free to contact us. Thank you for your reading.

Appendix: Data Sheet of RT/duroid 6002

RT/duroid 6002 Typical Value
Property	RT/duroid 6002	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.94±0.04	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign	2.94			8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0012	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+12	Z	ppm/ºC	10 GHz 0ºC-100ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	10^6	Z	Mohm.cm	A	ASTM D 257
Surface Resistivity	10^7	Z	Mohm	A	ASTM D 257
Tensile Modulus	828(120)	X,Y	MPa(kpsi)	23ºC	ASTM D 638
Ultimate Stress	6.9(1.0)	X,Y	MPa(kpsi)
Ultimate Strain	7.3	X,Y	%
Compressive Modulus	2482(360)	Z	MPa(kpsi)		ASTM D 638
Moisture Absorption	0.02		%	D48/50	IPC-TM-650 2.6.2.1 ASTM D 570
Thermal Conductivity	0.6		W/m/k	80ºC	ASTM C518
Coefficient of Thermal Expansion (-55 to 288ºC)	16 16 24	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.41
Td	500		ºC TGA		ASTM D 3850
Density	2.1		gm/cm^3		ASTM D 792
Specific Heat	0.93(0.22)		j/g/k (BTU/ib/^OF)		Calculated
Copper Peel	8.9(1.6)		Ibs/in.(N/mm)		IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes