Taconic Tlx-8 High Frequency PCB 62mil 1.575mm Tlx-8 RF Circuit Board with OSP

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tlx-8
• Model NO.: BIC-193-V1.51
• Material: PTFE
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Glass Reinforced Hydrocarbon and Epoxy Resin
• Final Foil External: 1 Oz
• Final Height of PCB: 1.6 mm ±10%
• Surface Finish: OSP
• Minimum Trace and Space: 10 Mil/15 Mil
• Minimum / Maximum Holes: 0.5/2.0mm
• Test: 100% Electrical Test Prior Shipment
• Via: UL 94-V0 Approval Min
• Transport Package: Vacuum
• Specification: 99x 88mm=1PCS
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

 Taconic TLX-8 High Frequency PCB 62mil 1.575mm TLX-8 RF Circuit Board with OSP
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.

TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.

TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.
 
There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).

Benefits:
Excellent mechanical & thermal properties
Low & stable DK
Dimensionally stable
Low moisture absorption
UL 94 V-O rating
Tightly controlled DK
Low DF
For low layer count microwave designs

Applications:
Antennas
Couplers, Splitters, Combiners,
Amplifiers, Mixers, Filters
Passive components

PCB Specifications

Taconic TLX-8 62mil 1.575mm RF Antenna PCB TLT-8 High Frequency PCB for Directional Coupler
PCB SIZE	99 x 88mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 35um(1 oz)+plate TOP layer
	TLX-8 1.575mm
	copper ------- 35um(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	15 mil / 10 mil
Minimum / Maximum Holes:	0.5mm/2.0mm
Number of Different Holes:	N/A
Number of Drill Holes:	N/A
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	TLX-8 1.575mm
Final foil external:	1 oz
Final foil internal:	N/A
Final height of PCB:	1.6 mm ±10%
PLATING AND COATING
Surface Finish	OSP
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	N/A
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Typical Value of TLX-8

TLX-8 TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK @10 GHz	IPC-650 2.5.5.3		2.55		2.55
Df @1.9 GHz	IPC-650 2.5.5.5.1		0.0012		0.0012
Df @10 GHz	IPC-650 2.5.5.5.1		0.0017		0.0017
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Flexural Strength(MD)	ASTM D 709	psi	28,900	N/mm^2
Flexural Strength(CD)	ASTM D 709	psi	20,600	N/mm^2
Tensile Strength(MD)	ASTM D 902	psi	35,600	N/mm^2
Tensile Strength(CD)	ASTM D 902	psi	27,500	N/mm^2
Elongation at Break(MD)	ASTM D 902	%	3.94	%	3.94
Elongation at Break(CD)	ASTM D 902	%	3.92	%	3.92
Young's Modulus(MD)	ASTM D 902	kpsi	980	N/mm^2
Young's Modulus(CD)	ASTM D 902	kpsi	1,200	N/mm^2
Young's Modulus(MD)	ASTM D 3039	kpsi	1,630	N/mm^2
Poisson's Ratio	ASTM D 3039		0.135	N/mm
Peel Stength(1 oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	15	N/mm
Peel Stength(1 oz.RTF)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	17	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8.3(Elevated Temp.)	Ibs./linear inch	14	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	11	N/mm
Peel Stength(1 oz.rolled)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	13	N/mm	2.1
Thermal Conductivity	ASTM F433/ASTM 1530-06	W/M*K	0.19	W/M*K	0.19
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(After Bake.)	mils/in.	0.06	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.4(After Bake.)	mils/in.	0.08	mm/M
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.09	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.1	mm/M
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm	6.605 x 10^8	Mohm	6.605 x 10^8
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm	3.550 x 10^6	Mohm	3.550 x 10^6
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm/cm	1.110 x 10^10	Mohm/cm	1.110 x 10^10
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm/cm	1.046 x 10^10	Mohm/cm	1.046 x 10^10
CTE(X axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	21	ppm/ºC	21
CTE(Y axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	23	ppm/ºC	23
CTE(Z axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	215	ppm/ºC	215
Density(Specific Gravity)	ASTM D 792	g/cm^3	2.25	g/cm^3	2.25
Td(2% Weight Loss)	IPC-650 2.4.24.6(TGA)	ºC	535	ºC
Td(5% Weight Loss)	IPC-650 2.4.24.6(TGA)	ºC	553	ºC
Flammability Rating	UL-94		V-0		V-0