Rogers Tmm3 PCB Board 15mil 30mil 60mil at Low Electronic Components Price

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-155-V2.1
• Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 15mil 30mil 60mil
• Layer Count: Double Layer, Multilayer, Hybrid PCB
• Application: Stripline and Microstrip
• Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin, Immer
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers TMM3 High Frequency Printed Circuit Board 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Rogers' TMM3 high-frequency laminates are advanced ceramic-reinforced hydrocarbon thermoset composites engineered for high-reliability stripline and microstrip circuits. With a stable dielectric constant of 3.27 and an ultra-low dissipation factor of 0.002, TMM3 ensures consistent RF performance.


Key Advantages
Exceptional Stability: The dielectric constant remains highly stable over temperature, with minimal variation.

CTE-Matched to Copper: The material's isotropic thermal expansion closely aligns with copper, enhancing plated through-hole (PTH) reliability and minimizing etch shrinkage.

Superior Thermal Management: With roughly double the thermal conductivity of standard PTFE/ceramic laminates, TMM3 effectively dissipates heat, improving power handling.

Thermoset Durability: Unlike thermoplastics, TMM3 retains rigidity at elevated temperatures, enabling reliable wire bonding without pad lifting or substrate warping.

 

This combination of electrical stability, mechanical robustness, and thermal efficiency makes TMM3 ideal for demanding high-frequency applications.
 

Typical Applications
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems

Our PCB Capabilities (TMM3)  

PCB Capability (TMM3)
PCB Material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM3
Dielectric constant:	3.27
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),  150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, ENEPIG etc..

Why Choose Us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years' high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We're a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000 workshop, 30000 output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3

Typical Value of TMM3

TMM3 Typical Value
Property		TMM3	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		3.27±0.032	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		3.45	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		+37	-	ppm/°K	-55ºC-125ºC	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 109	-	Mohm.cm	-	ASTM D257
Surface Resistivity		>9x 10^9	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		441	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	ºCTGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		15	X	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		15	Y	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		23	Z	ppm/K	0 to 140 ºC	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.7	Z	W/m/K	80 ºC	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.7 (1.0)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		16.53	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.72	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.06	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.12
Specific Gravity		1.78	-	-	A	ASTM D792
Specific Heat Capacity		0.87	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-