Multilayer PCB 4 Layer Circuit Board 2.0mm PCB Circuits 368
Commodity Introduction
This is a type of 4 layer 2.0mm board for the application of Wireless Signal Booster with Immersion gold pad finish. The base laminate is from ITEQ, Green Solder mask from Kuangshun and White silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed separately.
Parameter & Data Sheet
Number of Layers |
4 |
Board Type |
Multilayer PCB |
Board Thickness |
2.0mm +/-0.2 |
Board Material |
FR-4 |
Board Material Supplier |
ITEQ |
Tg Value of Board Material |
135ºC |
|
PTH Cu thickness |
≥20 um (See hole wall details) |
Inner Iayer Cu thicknes |
35 um (1oz) |
Surface Cu thickness |
35 um (1oz) |
|
Solder Mask Type and Model No. |
LPSM, PSR-2000GT600D |
Solder Mask Supplier |
TAIYO |
Solder Mask Colour |
Green |
Number of Solder Masks |
2 |
Thickness of Solder Mask |
13um |
|
Type of Silkscreen Ink |
IJR-4000 MW300 |
Supplier of Silkscreen |
TAIYO |
Color of Silkscreen |
Whie |
Number of Silkscreen |
2 |
|
Mininum Trace (mil) |
8 mil |
Minimum Gap(mil) |
8 mil |
|
Surface Finish |
Immersion gold |
RoHS Required |
Yes |
Warpage |
0.25% |
|
Thermal Shock Test |
Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Solderablity Test |
Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
Function |
100% Pass electrical test |
Workmanship |
Compliance with IPC-A-600H & IPC-6012C Class 2 |
Microsection Hole Wall (um)
Hole Wall Cu Thickness |
≥20 um |
Hole Wall Cu Roughness |
≤25.4 um |
NO. |
A |
B |
C |
D |
E |
F |
AVE |
1 |
25.706 |
24.506 |
24.566 |
26.206 |
25.480 |
25.116 |
25.263 |
2 |
26.323 |
25.123 |
125.823 |
26.103 |
25.733 |
25.183 |
42.381 |
3 |
25.515 |
24.315 |
24.375 |
26.015 |
25.295 |
24.925 |
25.073 |
Outline dimension Unit: mm
NO. |
Required Dimension (toerance) |
Actual dimension |
1 |
162.00 |
±0.15 |
161.96 |
162.05 |
162.04 |
161.95 |
2 |
289.00 |
±0.15 |
288.97 |
289.12 |
288.98 |
288.97 |
Hole Size and Slot Dimension (mm)
NO. |
Requerment Dimension (tolerance) |
PTH/NPT |
Actual dimension |
1 |
2.500 |
±0.075 |
Y |
2.500 |
2.475 |
2.525 |
2.500 |
2 |
2.200 |
±0.075 |
Y |
2.200 |
2.175 |
2.225 |
2.200 |
3 |
1.000 |
±0.075 |
Y |
1.000 |
0.975 |
1.025 |
1.000 |
4 |
0.900 |
±0.075 |
Y |
0.900 |
0.875 |
0.925 |
0.900 |
5 |
3.200 |
±0.05 |
Y |
3.200 |
3.175 |
3.225 |
3.200 |
Fast PCB prototypes
Category |
Fastest lead time |
Stanardard lead time |
2 layer |
24 hrs |
4 days |
4 layer |
48 hrs |
5 days |
6 layer |
72 hrs |
7 days |
8 layer |
96 hrs |
9 days |
10 layer |
120 hrs |
11 days |
12 layer |
120 hrs |
12 days |
14 layer |
144 hrs |
15 days |
16-20 layer |
Depends on specifications |
20 layer above |
Depends on specifications |