Multilayer PCB 4 Layer Circuit Board 2.0mm PCB Circuits

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
Shipping & Policy
Shipping Cost: Contact the supplier about freight and estimated delivery time.
Payment Methods:
visa mastercard discover JCB diners club american express T/T
PIX SPEI OXXO PSE OZOW
  Support payments in USD
Secure payments: Every payment you make on Made-in-China.com is protected by the platform.
Refund policy: Claim a refund if your order doesn't ship, is missing, or arrives with product issues.
Secured Trading Service
Gold Member Since 2017

Suppliers with verified business licenses

Audited Supplier Audited Supplier

Audited by an independent third-party inspection agency

to see all verified strength labels (14)
Find Similar Products

Basic Info.

Model NO.
BIC-14651-V1.2
Material
Fiberglass Epoxy
Application
Wireless Signal Booster
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Enig
Base Material
Copper Clad Laminate
Insulation Materials
Epoxy Resin
Brand
Bicheng
Transport Package
Vacuum
Specification
162 X 289mm =2pcs
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
12000 Pieces Per Month

Product Description

Multilayer PCB 4 Layer Circuit Board 2.0mm PCB Circuits 368


Commodity Introduction
This is a type of 4 layer 2.0mm board for the application of Wireless Signal Booster with Immersion gold pad finish. The base laminate is from ITEQ, Green Solder mask from Kuangshun and White silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed separately.


Parameter & Data Sheet
Number of Layers 4
Board Type Multilayer PCB
Board Thickness 2.0mm +/-0.2
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 135ºC
 
PTH Cu thickness ≥20 um (See hole wall details)
Inner Iayer Cu thicknes 35 um (1oz)
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAIYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 13um
 
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen Whie
Number of Silkscreen 2
 
Mininum Trace (mil) 8 mil
Minimum Gap(mil) 8 mil
 
Surface Finish Immersion gold
RoHS Required Yes
Warpage  0.25%
 
Thermal Shock Test Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2

Microsection Hole Wall (um)  
Hole Wall Cu Thickness ≥20 um  Hole Wall Cu Roughness ≤25.4 um
NO. A B C E AVE
1 25.706 24.506 24.566 26.206 25.480 25.116 25.263
2 26.323 25.123 125.823 26.103 25.733 25.183 42.381
3 25.515 24.315 24.375 26.015 25.295 24.925 25.073

Outline dimension  Unit: mm
NO. Required Dimension (toerance) Actual dimension
1 162.00 ±0.15 161.96 162.05 162.04 161.95
2 289.00 ±0.15 288.97 289.12 288.98 288.97

Hole Size and Slot Dimension (mm)
NO. Requerment Dimension (tolerance) PTH/NPT Actual dimension
1 2.500 ±0.075 Y 2.500 2.475 2.525 2.500
2 2.200 ±0.075 Y 2.200 2.175 2.225 2.200
3 1.000 ±0.075 Y 1.000 0.975 1.025 1.000
4 0.900 ±0.075 Y 0.900 0.875 0.925 0.900
5 3.200 ±0.05 Y 3.200 3.175 3.225 3.200


Fast PCB prototypes
Category Fastest lead time Stanardard lead time
2 layer 24 hrs 4 days
4 layer 48 hrs 5 days
6 layer 72 hrs 7 days
8 layer 96 hrs 9 days
10 layer 120 hrs 11 days
12 layer 120 hrs 12 days
14 layer 144 hrs 15 days
16-20 layer Depends on specifications
20 layer above Depends on specifications




Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now