| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | CEM-4 |
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| PCB SIZE | 99 x 99 mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RT/duroid 1.524mm | |
| copper ------- 18um(0.5 oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 2.0mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 3 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RT/duroid 1.524mm |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.6 mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (51.3% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | NO |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | NO |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| RT/duroid 6002 Typical Value | |||||
| Property | RT/duroid 6002 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.94±0.04 | Z | 10 GHz/23ºC | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.94 | 8GHz to 40 GHz | Differential Phase Length Method | ||
| Dissipation Factor,tanδ | 0.0012 | Z | 10 GHz/23ºC | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +12 | Z | ppm/ºC | 10 GHz 0ºC-100ºC | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm.cm | A | ASTM D 257 |
| Surface Resistivity | 107 | Z | Mohm | A | ASTM D 257 |
| Tensile Modulus | 828(120) | X,Y | MPa(kpsi) | 23ºC | ASTM D 638 |
| Ultimate Stress | 6.9(1.0) | X,Y | MPa(kpsi) | ||
| Ultimate Strain | 7.3 | X,Y | % | ||
| Compressive Modulus | 2482(360) | Z | MPa(kpsi) | ASTM D 638 | |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 ASTM D 570 |
|
| Thermal Conductivity | 0.6 | W/m/k | 80ºC | ASTM C518 | |
| Coefficient of Thermal Expansion (-55 to 288ºC) |
16 16 24 |
X Y Z |
ppm/ºC | 23ºC/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ºC TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | ASTM D 792 | ||
| Specific Heat | 0.93(0.22) | j/g/k (BTU/ib/OF) |
Calculated | ||
| Copper Peel | 8.9(1.6) | Ibs/in.(N/mm) | IPC-TM-650 2.4.8 | ||
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
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