Taconic RF-60tc Multilayer PCB Dk6.15 of Shenzhen PCB Custom

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RF-60tc
• Model NO.: BIC-166-V2.1
• Material: PTFE Based, Ceramic Filled Fiberglass
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Taconic
• Thickness: 10mil, 20mil, 30mil and 60mil
• Layer Count: Single Layer, Double Layer, Multilayer, Hybrid PCB
• Application: RF and Microwave
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Taconic RF-60TC High Frequency PCB 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. By improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications

RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.

RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC's low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.

Our PCB Capability (RF-60TC)

PCB Capability (RF-60TC)
PCB Material:	PTFE based, ceramic filled fiberglass
Designation:	RF-60TC
Dielectric constant:	6.15± 0.15 @10 GHz
Dissipation factor:	0.002 @10 GHz
Layer count:	Single Layer, Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35 µm), 2oz (70µm)
PCB thickness:	5mil (0.127mm), 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm),  60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..

Benefits

1. Improved loss tangent

- Lower insertion loss
- Enhanced antenna gain / efficiency
 

1. High thermal conductivity

- Exceptional thermal management
- Lower operating temperature
- Higher power application
- Loong term reliablity
 

1. Enhanced dimensional stability

 

1. Low Z-axis CTE

- Multilayer application available
- Reliable plated through hole
 

1. Excellent adhesion to metal

- Lower profile copper available
- Heavy metal back available
 

1. Stable DK over frequency
2. Stable DK over temperature

 

1. Low moisture absorption

 

Applications:
High power amplifier
Miniaturized antennas (GPS / PATCH / RFID Reader)
Filters, couplers, dividers
Satellites
 

Typical Value of RF-60TC

RF-60TC Typical Values
Property	Test Method	Unit	Value	Unit	Value
Dk @ 10 GHz	IPC-650 2.5.5.5.1 (Modified)		6.15 ± 0.15		6.15 ± 0.15
Df @ 10 GHz	IPC-650 2.5.5.5.1 (Modified)		0.002		0.002
TcK		ppm/°C	-3.581	ppm/°C	-3.581
Dielectric Breakdown	IPC-650 2.5.6	kV	55	kV	55
Dielectric Strength	IPC-650 2.5.6.2	V/mil	550	V/mm	21,654
Arc Resistance	IPC-650 2.5.1	Seconds	>180	Seconds	>180
Moisture Absorption	IPC-650 2.6.2.1	%	0.03	%	0.03
Flexural Strength (MD)	IPC-650 2.4.4	psi	10,000	N/mm2	69
Flexural Strength (CD)	IPC-650 2.4.4	psi	9,000	N/mm2	62
Tensile Strength (MD)	IPC-650 2.4.19	psi	9,000	N/mm2	62
Tensile Strength (CD)	IPC-650 2.4.19	psi	7,000	N/mm2	48
Young's Modulus (MD)	ASTM D 3039/IPC-TM-650 2.4.19	kpsi	721	N/mm2	4971
Poisson's Ratio (MD)	ASTM D 3039/IPC-TM-650 2.4.19		0.155		0.155
Peel Strength (1 oz. ED)	IPC-650 2.4.8	lbs/in	8	N/mm	1.43
Thermal Conductivity (Unclad)	IPC-650 2.4.50	W/M*K	0.9	W/M*K	0.9
Thermal Conductivity (CH/CH)	IPC-650 2.4.50	W/M*K	1	W/M*K	1
Thermal Conductivity (C1/C1)	IPC-650 2.4.50	W/M*K	1.05	W/M*K	1.05
Dimensional Stability (MD)	IPC-650 2.4.39 Sec. 5.4 (After Bake)	mils/in	0.01	mm/M	0.01
Dimensional Stability (CD)	IPC-650 2.4.39 Sec. 5.4 (After Bake)	mils/in	0.69	mm/M	0.69
Dimensional Stability (MD)	IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)	mils/in	0.06	mm/M	0.06
Dimensional Stability (CD)	IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)	mils/in	0.8	mm/M	0.8
Surface Resistivity	IPC-650 2.5.17.1 (After Humidity)	Mohm	1.0 x 108	Mohm	1.0 x 108
Volume Resistivity	IPC-650 2.5.17.1 (After Humidity)	Mohm/cm	1.0 x 108	Mohm/cm	1.0 x 108
CTE (X, Y axis)	IPC-650 2.4.41 (RT- 150 °C)	ppm/°C	9.9	ppm/°C	9.9
CTE (Z axis)	IPC-650 2.4.41 (RT- 150 °C)	ppm/°C	40	ppm/°C	40
Density (Specific Gravity)	IPC-650 2.3.5	g/cm3	2.84	g/cm3	2.84
Specific Heat	IPC-650 2.4.50	J/gK	0.94	J/gK	0.94
Td (2% Wt. Loss)	IPC - 650 2.4.24.6 / TGA	°F	930	°C	500
Td (5% Wt. Loss)	IPC - 650 2.4.24.6 / TGA	°F	960	°C	515
Flammability Rating	UL 94		V-0		V-0