SMD Stencil Built on 520 X 420mm with Aluminum Fame

• Customization: Available
• Disposable: Non-Disposable
• Material: Stainless Steel Shim
• Model NO.: BIC-0806-V8.06
• Type: SMT Stencil
• Structure: Stencil Foils with Aluminum Frame
• Foil Thickness: 0.12mm
• Aperture Configured: Laser Cut
• Base Material: Stainless Steel Shim
• Appearance: Engraving and Electro Polishing
• Fiducial Mark: Through Hole
• Service Area: Worldwide
• Quantity of Open Pads: 1124
• Application: Csp, BGA, 0.5mm Qfp etc. Package
• Transport Package: Vacuum
• Specification: 520mm x 420mm=1pcs
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 PCS/ Month

Product Description

1.1 General description

This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 420mm x 520mm
x20mm dimension. It's fabricated per IPC 7525A using supplied Gerber data, squeegee area
locating in the center. 4 sides of fiducal marks are through holes to suit for the SMT machine.
It's packed with KK carton (hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits
    
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4
     μm;
C. The opening of SMT template has geometric figure, which is advantageous to the printing and
     forming of tin paste;
D. ISO9000 certified manufacturing factory;
E. 12 hours quotation;
F. Quick Lead time: 1-2 days;
G.No MOQ, low cost for prototypes and small runs quantity;

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

1.4 Parameter and data sheet

Dimension:	520 x 420 mm =1 PCS
Structure	Stencil foils with aluminum frame
Base material	Stainless steel shim
Foil Thickness	0.12mm
Aperture configured	Laser cut
Appearance	Engraving and electro polishing
Fiducial mark	Through hole
Service area:	Worldwide
Quantity of open pads:	1124
Advantages:	a) High precision dimension;  b) Good shape on the window; c) Hole wall is smoother.
Application:	CSP, BGA, 0.5mm QFP etc. package

Opening Hole Design for Stencil

Component  Type	Pitch	Soldering  Width	Soldering  Length	Opening  Width	Opening  Length	Shim Thickness
PLCC	1.27mm	0.65mm	2.00mm	0.60mm	1.95mm	0.15-0.25mm
QFP	0.635mm	0.35mm	1.50mm	0.32mm	1.45mm	0.15-0.18mm
QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.20mm	0.12-0.15mm
QFP	0.40mm	0.25mm	1.25mm	0.20mm	1.20mm	0.10-0.12mm
QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.07-0.12mm
0402		0.50mm	0.65mm	0.45mm	0.60mm	0.12-0.15mm
0201		0.25mm	0.40mm	0.23mm	0.35mm	0.07-0.12mm
BGA	1.27mm	0.80mm		0.75mm	0.75mm	0.15-0.20mm
BGA	1.00mm	0.38mm		0.35mm	0.35mm	0.10-0.12mm
BGA	0.50mm	0.30mm		0.28mm	0.28mm	0.07-0.12mm
Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm
Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm