Ultra-Compact RO4003c PCB - 0.9mm Double-Sided with Enepig Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1007-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Ultra-Compact RO4003C PCB - 0.9mm Double-Sided with ENEPIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Advanced RF Circuit Board Overview
This precision-engineered double-sided PCB utilizes Rogers RO4003C high-performance laminate to deliver exceptional signal integrity in space-constrained RF applications. Designed for 5G infrastructure, automotive radar, and satellite communications, this ultra-compact 0.9mm thick board features ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finish for superior reliability in harsh environments.

Key Technical Advantages:
Superior Signal Integrity: Dielectric constant of 3.38±0.05 @ 10GHz with ultra-low loss (0.0027)
Miniaturized Design: Compact 40mm x 26mm footprint ideal for dense packaging
Premium Surface Treatment: ENEPIG finish offers excellent solderability and wire-bonding capability
Thermal Stability: CTE matched to copper (11/14 ppm/°C X/Y) with Tg >280°C
Cost-Efficient Production: Processes like standard FR-4 while delivering RF performance

2. Technical Specifications

Parameter	Specification
Base Material	Rogers RO4003C
Layer Configuration	Double-Sided
Board Dimensions	40mm x 26mm (±0.15mm)
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.3mm
Finished Thickness	0.9mm
Copper Weight	1 oz (35µm) all layers
Via Plating Thickness	1 mil
Surface Finish	ENEPIG
Solder Mask	None (Top & Bottom)
Silkscreen	None (Top & Bottom)
Quality Assurance	100% Electrical Tested

3. Engineering Features
Optimized Stackup Architecture
Conductive Layers: 35µm finished copper on both sides
Dielectric Core: 32mil RO4003C substrate for stable impedance
Thermal Management: 0.71 W/m/K conductivity for efficient heat dissipation

Manufacturing Excellence
High Component Density: 95 components with 112 pads (37 thru-hole, 75 SMT)
Precision Interconnects: 68 vias with 1 mil plating thickness
File Compatibility: Gerber RS-274-X format for seamless fabrication
Global Availability: Worldwide service for prototypes and production

Material Benefits
Frequency Stability: +40ppm/°C thermal coefficient of Dk
Moisture Resistance: 0.06% absorption rate ensures reliability
Dimensional Stability: CTE matched to copper prevents warping

Target Applications
5G Network Equipment: Base station antennas and RF front-ends
Automotive Radar: Collision avoidance and ADAS sensors
Satellite Communications: LNB modules for broadcast systems
RFID Systems: High-frequency identification tags

Competitive Advantages
1. Ultra-Compact Size: 40mm x 26mm footprint for space-constrained designs
2. High-Frequency Optimized: 5/6 mil trace/space for precision RF layouts
3. Premium Surface Finish: ENEPIG for superior solderability and wire bonding
4. Cost-Effective: FR-4 processing with superior RF performance

Order Your Custom RF Solution Today
Contact our engineering team for specialized configurations or production quotes. Perfect for applications requiring high-frequency performance in minimal space.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.