High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Rogers Rt/Duroid 6035HTC
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  • High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
  • High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
  • High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
  • High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
  • High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
  • High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
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Basic Info.

Model NO.
BIC-1069-V3.0
Material
Rt/Duroid 6035HTC
Application
Rt/Duroid 6035HTC
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Immersion Silver
Base Material
Rt/Duroid 6035HTC
Insulation Materials
PTFE-Based Dielectric
Brand
Rogers
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etc
Service Area
Worldwide, Globally
Transport Package
Vacuum Pack
Specification
76.05mm × 53.2mm
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB 

The 2-layer RT/duroid 6035HTC PCB is a high-frequency, high-power circuit board designed for demanding RF and microwave applications. With a 0.9mm finished thickness and 1 oz copper weight, this PCB offers exceptional thermal conductivity (1.44 W/m/K) and low insertion loss, making it ideal for power amplifiers, filters, and combiners. The board features a ceramic-filled PTFE composite base material, ensuring excellent dielectric stability and heat dissipation. Its 6/8 mil trace/space capability and 0.45mm minimum hole size support high-density designs, while the immersion silver surface finish enhances conductivity and reliability.

 
 

PCB Construction Details (Summary Table)

Parameter Specification
Base Material Rogers RT/duroid 6035HTC
Layer Count Double-sided (2-layer)
Board Dimensions 76.05mm x 53.2mm (±0.15mm)
Minimum Trace/Space 6/8 mils
Minimum Hole Size 0.45mm
Finished Thickness 0.9mm
Copper Weight (Outer) 1 oz (35µm)
Via Plating Thickness 20µm
Surface Finish Immersion Silver
Solder Mask/Silkscreen None
Electrical Test 100% tested prior to shipment


 

Other Key Components & Features

  • Stackup: The PCB consists of two 35µm copper layers with a 0.762mm (30mil) Rogers RT/duroid 6035HTC core, optimized for signal integrity and thermal management.
     

  • Performance Metrics:

    • Dielectric Constant (Dk): 3.5 ±0.05 at 10 GHz.

    • Low Loss: Dissipation factor of 0.0013 at 10 GHz.

    • Thermal Stability: CTE of 19 ppm/°C (X/Y-axis) and 39 ppm/°C (Z-axis).

 

Material Advantages

  • High Thermal Conductivity: 1.44 W/m/K at 80°C, enabling efficient heat dissipation in high-power applications.

  • Low Dielectric Loss: Dissipation factor of 0.0013 at 10 GHz ensures minimal signal degradation.

  • Stable Dk: Dielectric constant of 3.5 ±0.05 at 10 GHz, providing consistent performance across frequencies.

  • Moisture Resistance: Low absorption rate (0.06%) for reliability in humid environments.

  • Thermal Stability: CTE of 19 ppm/°C (X/Y-axis) and 39 ppm/°C (Z-axis) reduces warping risks.
     

    High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
    High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0

     

 

Typical Applications

  • High-Power RF/Microwave Circuits: Amplifiers, couplers, filters, and power dividers.

  • Telecom Infrastructure: Base stations, radar systems, and satellite communication devices.

  • Aerospace & Defense: Reliable performance in extreme conditions.
     

    Why Choose This PCB?

  • Superior High-Frequency Performance: Optimized for RF/microwave signals with low insertion loss.

  • Enhanced Thermal Management: Ceramic-filled PTFE composite dissipates heat 2.4x better than standard materials.

  • Precision Manufacturing: Complies with IPC-Class-2 standards, ensuring durability and consistency.

  • Cost-Effective Drilling: Advanced filler system reduces machining costs compared to alumina-based laminates.

  • Global Availability: Ready for integration into projects worldwide with Gerber RS-274-X files.

    Tags: RT/duroid 6035HTC PCB, 2-layer high-frequency PCB, 0.9mm thick PCB, RF microwave circuit board, high thermal conductivity PCB

 

Order Now for High-Power RF/Microwave PCB Solutions!
Upgrade your high-frequency designs with our RT/duroid 6035HTC 2-layer PCB - engineered for superior thermal management and signal integrity in demanding RF applications.

 
 
High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0
High-Performance 2-Layer Rt/Duroid 6035HTC PCB with 94V0

 

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