| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Rogers Rt/Duroid 6035HTC |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Overview of This Type of PCB
The 2-layer RT/duroid 6035HTC PCB is a high-frequency, high-power circuit board designed for demanding RF and microwave applications. With a 0.9mm finished thickness and 1 oz copper weight, this PCB offers exceptional thermal conductivity (1.44 W/m/K) and low insertion loss, making it ideal for power amplifiers, filters, and combiners. The board features a ceramic-filled PTFE composite base material, ensuring excellent dielectric stability and heat dissipation. Its 6/8 mil trace/space capability and 0.45mm minimum hole size support high-density designs, while the immersion silver surface finish enhances conductivity and reliability.
| Parameter | Specification |
|---|---|
| Base Material | Rogers RT/duroid 6035HTC |
| Layer Count | Double-sided (2-layer) |
| Board Dimensions | 76.05mm x 53.2mm (±0.15mm) |
| Minimum Trace/Space | 6/8 mils |
| Minimum Hole Size | 0.45mm |
| Finished Thickness | 0.9mm |
| Copper Weight (Outer) | 1 oz (35µm) |
| Via Plating Thickness | 20µm |
| Surface Finish | Immersion Silver |
| Solder Mask/Silkscreen | None |
| Electrical Test | 100% tested prior to shipment |
Stackup: The PCB consists of two 35µm copper layers with a 0.762mm (30mil) Rogers RT/duroid 6035HTC core, optimized for signal integrity and thermal management.
Performance Metrics:
Dielectric Constant (Dk): 3.5 ±0.05 at 10 GHz.
Low Loss: Dissipation factor of 0.0013 at 10 GHz.
Thermal Stability: CTE of 19 ppm/°C (X/Y-axis) and 39 ppm/°C (Z-axis).
High Thermal Conductivity: 1.44 W/m/K at 80°C, enabling efficient heat dissipation in high-power applications.
Low Dielectric Loss: Dissipation factor of 0.0013 at 10 GHz ensures minimal signal degradation.
Stable Dk: Dielectric constant of 3.5 ±0.05 at 10 GHz, providing consistent performance across frequencies.
Moisture Resistance: Low absorption rate (0.06%) for reliability in humid environments.
Thermal Stability: CTE of 19 ppm/°C (X/Y-axis) and 39 ppm/°C (Z-axis) reduces warping risks.
High-Power RF/Microwave Circuits: Amplifiers, couplers, filters, and power dividers.
Telecom Infrastructure: Base stations, radar systems, and satellite communication devices.
Aerospace & Defense: Reliable performance in extreme conditions.
Superior High-Frequency Performance: Optimized for RF/microwave signals with low insertion loss.
Enhanced Thermal Management: Ceramic-filled PTFE composite dissipates heat 2.4x better than standard materials.
Precision Manufacturing: Complies with IPC-Class-2 standards, ensuring durability and consistency.
Cost-Effective Drilling: Advanced filler system reduces machining costs compared to alumina-based laminates.
Global Availability: Ready for integration into projects worldwide with Gerber RS-274-X files.
Tags: RT/duroid 6035HTC PCB, 2-layer high-frequency PCB, 0.9mm thick PCB, RF microwave circuit board, high thermal conductivity PCB
Order Now for High-Power RF/Microwave PCB Solutions!
Upgrade your high-frequency designs with our RT/duroid 6035HTC 2-layer PCB - engineered for superior thermal management and signal integrity in demanding RF applications.
){kind=link}