Rogers RO4350b+Fr-4 Multilayer PCB Wholesale Electronics Circuit Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4350b
• Model NO.: BIC-1044-V2.1
• Material: RO4350b + High Tg 170°c Fr-4
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Gold
• Layer Count: 6 Layers
• Solder Mask: Matte Black (Top/Bottom)
• Silkscreen: White (Top/Bottom)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 50mm x 38mm (± 0.15mm)
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

High-Performance 6-Layer RO4350B+FR-4 PCB with 1.0mm Thickness for 5G, Automotive Radar & RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

1. Overview of RO4350B+FR-4 6-Layer PCB

This advanced 6-layer rigid PCB combines Rogers RO4350B high-frequency laminate with High Tg 170°C FR-4 to deliver exceptional performance for demanding RF and microwave applications. Designed for 5G base stations, automotive radar systems, and satellite communication devices, it offers ultra-low signal loss, impedance control (50Ω on top layer), and superior thermal stability (Tg >280°C). The hybrid stackup leverages RO4350B PCB's low-loss ceramic-hydrocarbon composite for critical RF layers and cost-effective FR-4 for internal cores, ensuring optimal electrical performance while maintaining FR-4-like manufacturability. With a compact 50mm x 38mm footprint and 1.0mm total thickness,  RO4350B with FR-4 PCB is engineered for high-density, high-reliability designs in harsh environments.
 

 

2. PCB Construction Details (Table)

Parameter	Specification
Base Material	RO4350B + High Tg 170°C FR-4 Hybrid Stackup
Layer Count	6 Layers
Board Dimensions	50mm x 38mm (±0.15mm)
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.1mm (laser-drilled)
Via Type	Through-Hole Only (No Blind Vias)
Finished Thickness	1.0mm
Copper Weight	1oz (35μm) All Layers
Via Plating Thickness	20μm
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Solder Mask	Matte Black (Top/Bottom)
Silkscreen	White (Top/Bottom), Avoids Solder Pads
Impedance Control	50Ω on Top Layer (19.4mil Trace, Referenced to L2)
Via Filling	0.1mm Vias Filled with Resin (IPC-4761 Type VII)
Electrical Testing	100% Pre-Shipment Test
Compliance	IPC-Class-2 Standard

Stackup Structure: 6-layer rigid PCB    
                                                                                         
Copper        Layer-1      35 micron                                 
RO4350B     Core 0.254mm (10mil)
Copper        Layer-2      35 micron
Prepreg       High Tg 1080 0.0750mm
Copper        Layer-3      35 micron
FR-4 Core    High Tg     0.11mm
Copper        Layer-4      35 micron
Prepreg       High Tg     0.075mm
Copper        Layer-5      35 micron     
RO4350B      Core 0.254mm (10mil)
Copper        Layer-6      35 micron   
 

1. Additional Components & Features

Material Advantages:
Dielectric Constant (Dk): 3.48 ±0.05 @ 10GHz (stable up to 280°C).
Ultra-Low Loss: Dissipation Factor 0.0037 @ 10GHz for minimal signal degradation.
Thermal Stability: Z-axis CTE of 32ppm/°C ensures reliable plated through-holes under thermal stress.
UL 94 V-0 Rated: Flame-retardant and suitable for high-power RF designs.
 

Design Specifications:
Supports complex layouts (70 components, 49 vias, 16 nets).
Gerber RS-274-X files accepted for seamless fabrication.
Resin-filled vias enhance mechanical durability and signal integrity.

Global Applications:
Automotive radar/sensors, 5G infrastructure, RF identification tags, and satellite LNBs.
Shipped worldwide with IPC-Class-2 quality assurance.

 

 

Why Choose This PCB?

This 6-layer RO4350B+FR-4 hybrid PCB is a game-changer for high-frequency systems, offering unmatched RF precision, thermal resilience, and cost efficiency. With its ENIG finish, impedance control, and resin-filled vias, it's engineered to outperform in 5G, automotive, and aerospace applications. Ideal for engineers seeking reliability, scalability, and cutting-edge performance.

Tags: RO4350B PCB, 6-Layer PCB, 1.0mm Thickness, High-Frequency PCB, ENIG Finish, IPC-Class-2, Automotive Radar PCB, 5G Base Station PCB, Hybrid Stackup, Low-Loss PCB.

Order Now for 5G and automotive radar designs! 
Elevate your 5G and automotive radar designs with this 6-layer RO4350B+FR-4 hybrid PCB-featuring 1.0mm thickness, ENIG finish for flawless signal integrity. Backed by IPC-Class-2 compliance and global availability, it's the ultimate choice for engineers demanding high-frequency precision, thermal resilience, and scalable production-order today to power innovation!