Ultra-Thin RO4360G2 RF PCB - 0.6mm Double-Sided with Immersion Silver Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. High-Performance RF Board Overview
This advanced double-sided PCB utilizes Rogers RO4360G2 high-frequency laminate to deliver exceptional electrical performance in compact wireless applications. Designed for 5G infrastructure, small cell transceivers, and base station amplifiers, this ultra-thin 0.6mm board features immersion silver surface finish and complies with IPC-Class-2 standards for reliable operation in demanding environments.
Key Technical Benefits:
High Dielectric Constant (6.15±0.15 @ 10GHz): Enables compact circuit designs
Ultra-Low Profile: 0.6mm thickness ideal for space-constrained applications
Enhanced Thermal Management: 0.75 W/m/K conductivity for efficient heat dissipation
Cost-Efficient Manufacturing: Processes like standard FR-4 with superior RF performance
Environmental Compliance: Lead-free process compatible and 94V-0 rated
2. Technical Specifications
| Parameter |
Specification |
| Base Material |
Rogers RO4360G2 |
| Layer Configuration |
Double-Sided |
| Board Dimensions |
43mm x 86mm (±0.15mm) |
| Minimum Trace/Space |
7/9 mils |
| Minimum Hole Size |
0.3mm |
| Finished Thickness |
0.6mm |
| Copper Weight |
1 oz (35µm) all layers |
| Via Plating Thickness |
1 mil |
| Surface Finish |
Immersion Silver |
| Solder Mask |
None (Top & Bottom) |
| Silkscreen |
None (Top & Bottom) |
| Quality Assurance |
100% Electrical Tested |
3. Advanced Engineering Features
Optimized Stackup Configuration
Conductive Layers: 35µm copper (top and bottom)
Dielectric Core: 20mil RO4360G2 substrate
Thermal Properties: CTE matched to copper (13/14 ppm/°C X/Y)
Manufacturing Precision
Component Density: 35 components with 90 pads (26 thru-hole, 64 SMT)
Interconnect Solution: 46 precision vias
File Compatibility: Gerber RS-274-X format
Global Availability: Worldwide production support
Material Superiority
Frequency Stability: High Tg (>280°C) maintains performance at elevated temperatures
Moisture Resistance: Low absorption for reliable operation
Plated Through-Hole Reliability: Excellent Z-axis CTE (28 ppm/°C)
Target Applications
5G Infrastructure: Small cell transceivers and power amplifiers
Wireless Communications: Base station components
RF Modules: High-frequency circuit designs
Competitive Advantages
1. Space-Saving Design: Ultra-thin 0.6mm profile
2. High-Frequency Performance: 7/9 mil trace/space capability
3. Thermal Efficiency: Copper-matched CTE prevents delamination
4. Cost-Effective: FR-4 processing with RF material benefits
Order Your Custom RF Solution Today
Contact our engineering team for specialized configurations or production quotes. Ideal for applications requiring high-frequency performance in minimal space.
Thank you for your reading and you're welcome to contact us for your PCB enquiries.
Audited Supplier 
Thank you for your reading and you're welcome to contact us for your PCB enquiries.
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