Low Loss Rt/Duroid 5880 PCB 31mil Thick - Precision 0.9mm RF Circuit Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 5880 PCB
• Model NO.: BIC-1010-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Low Loss RT/duroid 5880 PCB - Precision 0.9mm RF Circuit Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. High-Frequency Circuit Board Overview
Engineered for critical microwave and millimeter-wave applications, this double-sided PCB utilizes Rogers RT/duroid 5880 laminate to deliver unmatched signal integrity. Designed for aerospace communications, radar systems, and broadband antennas, this 0.9mm thick board features ENIG (Electroless Nickel Immersion Gold) surface finish for superior reliability in demanding environments.

Key Performance Characteristics:
Exceptional Signal Purity: Ultra-low 0.0009 dissipation factor at 10GHz
Frequency Stability: 2.2±0.02 dielectric constant maintained across wide bandwidths
Precision Fabrication: 4/7 mil trace/space capability for complex RF layouts
Environmental Resistance: 0.02% moisture absorption for humid conditions
Manufacturing Efficiency: Easily machined PTFE composite material

2. Technical Specifications

Parameter	Specification
Core Material	RT/duroid 5880
Layer Configuration	Double-Sided
Board Dimensions	195mm x 182mm (±0.15mm)
Minimum Trace/Space	4/7 mils
Minimum Hole Size	0.25mm
Finished Thickness	0.9mm
Copper Weight	1 oz (35µm) all layers
Via Plating Thickness	1 mil
Surface Treatment	ENIG
Thermal Characteristics	-125 ppm/°C TCDk
Quality Certification	IPC-Class-II Compliant

3. Advanced Engineering Features
Optimized Signal Transmission
Ultra-Low Loss Dielectric: Glass microfiber-reinforced PTFE composite
Consistent Performance: Isotropic properties ensure uniform signal propagation
Precision Impedance Control: Tight Dk tolerance (±0.02) for high-frequency circuits

Manufacturing Advantages
Component Integration: 54 components with 91 pads (39 thru-hole, 52 SMT)
High-Density Interconnects: 43 precision vias with 1 mil plating
Chemical Resistance: Withstands all standard PCB processing chemicals
Global Availability: Worldwide production support

Material Superiority
Frequency Stability: Maintains performance to Ku-band and beyond
Thermal Consistency: -125 ppm/°C TCDk for temperature-stable operation
Mechanical Workability: Easily machined without special tooling

Target Applications
Aerospace Systems: Airborne broadband antennas and avionics
Defense Electronics: Radar and missile guidance systems
Telecommunications: Point-to-point radio links
Research Equipment: Millimeter-wave test instrumentation

Competitive Benefits
1. Industry-Leading Performance: Lowest loss among reinforced PTFE materials
2. Design Flexibility: 4/7 mil trace/space enables complex RF layouts
3. Environmental Durability: Exceptional moisture and chemical resistance
4. Proven Reliability: Well-established material with consistent quality

Request Your Precision RF Solution
Contact our engineering team for custom configurations or production quotes. Ideal for applications requiring ultra-low loss signal transmission.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.