High-Power RF PCB with Rt/Duroid 6035HTC - Ultra-Thin 20mil 0.6mm Design for Demanding Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 6035HTC
• Model NO.: BIC-1009-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Power RF PCB with RT/duroid 6035HTC - Ultra-Thin 0.6mm Design for Demanding Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Advanced Thermal Management PCB Overview
Engineered for high-power RF and microwave systems, this double-sided PCB utilizes Rogers RT/duroid 6035HTC laminate to deliver exceptional thermal performance and signal integrity. Designed for power amplifiers, combiners, and high-frequency filters, this ultra-thin 0.6mm board features immersion silver surface finish and 1.5 oz copper layers for superior current handling capability.

Critical Performance Advantages:
Exceptional Thermal Dissipation: 1.44 W/m/K conductivity (2.4× standard materials)
Ultra-Low Signal Loss: Dissipation factor of 0.0013 @ 10GHz
High-Power Capability: 1.5 oz copper weight (2.1 mils) for enhanced current capacity
Thermal Stability: -66 ppm/°C dielectric constant thermal coefficient
Precision Manufacturing: 9/9 mil trace/space with 0.3mm minimum holes

2. Technical Specifications

Parameter	Specification
Base Material	RT/duroid 6035HTC
Layer Configuration	Double-Sided
Board Dimensions	132mm x 101mm (±0.15mm)
Minimum Trace/Space	9/9 mils
Minimum Hole Size	0.3mm
Finished Thickness	0.6mm
Copper Weight	1.5 oz (53µm) all layers
Via Plating Thickness	1 mil
Surface Finish	Immersion Silver
Thermal Conductivity	1.44 W/m/K @ 80°C
Quality Assurance	100% Electrical Tested

3. Engineering Excellence
Optimized Thermal Architecture
Enhanced Copper Layers: 53µm finished copper for high-current applications
Advanced Dielectric Core: 20mil RT/duroid 6035HTC with ceramic-PTFE composite
Efficient Heat Path: CTE of 19/19/39 ppm/°C (X/Y/Z) for thermal stability

Manufacturing Precision
Component Integration: 35 components with 90 pads (26 thru-hole, 64 SMT)
High-Density Interconnects: 46 precision vias with 1 mil plating
Drilling Efficiency: Special filler system reduces machining costs
Global Production Support: Worldwide availability for prototypes and volume

Material Advantages
Frequency Stability: DK 3.5±0.05 maintained across temperature ranges
Moisture Resistance: 0.06% absorption for reliable operation
Power Handling: Superior thermal management for high-power designs

Target Applications
RF Power Systems: High-power amplifiers and transmitters
Microwave Components: Couplers, dividers, and combiners
Defense Electronics: Radar and communication systems
Telecom Infrastructure: 5G base station components

Competitive Benefits
1. Unmatched Thermal Performance: 1.44 W/m/K conductivity
2. High-Power Design: 1.5 oz copper for current-intensive applications
3. Signal Integrity: Ultra-low 0.0013 dissipation factor
4. Manufacturing Efficiency: Easier drilling than alumina-filled alternatives

Request Your High-Power RF Solution
Contact our engineering team for custom configurations or production quotes. Ideal for applications requiring exceptional thermal management and power handling.




Thank you for your reading and you're welcome to contact us for your PCB enquiries.