RF-35 Ultra-Thin PCB - 0.3mm Double-Sided Board with 5/4 Mil Trace/Space for Microwave Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RF-35
• Model NO.: BIC-1025-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RF-35 Ultra-Thin PCB - 0.3mm Double-Sided Board with 5/4 mil Trace/Space for Microwave Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Compact RF Solution Overview
This innovative double-sided PCB utilizes Taconic's RF-35 organic-ceramic laminate to deliver exceptional high-frequency performance in an ultra-slim 0.3mm profile. Designed for commercial microwave applications, this board combines cost-effective manufacturing with professional-grade RF characteristics, making it ideal for power amplifiers, filters, and passive components.

Key Benefits:
Space-saving design: 0.3mm thickness enables compact device integration
Superior signal integrity: 0.0018 ultra-low dissipation factor at 1.9GHz
Enhanced durability: Outstanding 10 lbs/inch peel strength for 1oz copper
Moisture resistant: Only 0.02% absorption for reliable operation

2. Technical Specifications

Parameter	Specification
Material	Taconic RF-35 Organic-Ceramic
Configuration	Double-Layer
Dimensions	48mm × 80.12mm (±0.15mm)
Thickness	0.3mm (10mil dielectric)
Copper Weight	1oz (35μm) both layers
Trace/Space	5/4 mils
Minimum Hole	0.25mm
Surface Finish	Immersion Silver
Via Count	16
Flammability Rating	UL-94 V0

3. Engineering Advantages
Material Excellence
Consistent Performance: 3.5 dielectric constant at 1.9GHz
Thermal Stability: CTE of 19/24/64 ppm/°C (X/Y/Z)
Manufacturing Friendly: Smooth surface for precise etching

Design Features
Component Support: 7 devices (12 thru-hole, 9 SMT)
High-Density Capable: 5/4 mil trace/space technology
Reliable Interconnects: 16 plated through holes
File Compatibility: Gerber RS-274-X format

Target Applications
RF Power Systems: Efficient signal amplification
Frequency Control: Precision filters and couplers
Wireless Infrastructure: Base station components
IoT Devices: Compact wireless modules

Competitive Advantages:
1. Commercial-Grade Pricing with RF performance
2. Exceptional Copper Adhesion for rework capability
3. Ultra-Low Moisture Absorption for stable operation
4. Flame Retardant for safety-critical applications

Request Your Custom RF Board
Our technical team can adapt this platform for your specific requirements, offering global manufacturing support and design consultation for your high-frequency projects.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.