Rt/Duroid 6006 High-Dk PCB - 1.3mm Double-Sided Board with 8/7 Mil Trace/Space for RF Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 6006
• Model NO.: BIC-1024-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RT/duroid 6006 High-Dk PCB - 1.3mm Double-Sided Board with 8/7 mil Trace/Space for RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Premium RF Circuit Board Solution
This high-performance double-sided PCB utilizes Rogers RT/duroid 6006 laminate, a ceramic-PTFE composite engineered for compact RF designs requiring a high dielectric constant. With its 6.15±0.15 Dk value at 10GHz, this 1.3mm thick board enables significant circuit size reduction while maintaining excellent signal integrity for applications up to X-band frequencies.

Key Advantages:
Space-Saving Design: High Dk allows for compact circuit layouts
Low-Loss Performance: 0.0027 dissipation factor at 10GHz
Reliable Construction: 1.3mm thickness with 50mil dielectric core
Precision Manufacturing: 8/7 mil trace/space capability

2. Technical Specifications

Parameter	Specification
Base Material	RT/duroid 6006 Ceramic-PTFE
Layer Configuration	Double-Sided
Board Dimensions	77mm × 59mm (2 designs, 2 boards)
Finished Thickness	1.3mm (50mil dielectric)
Copper Weight	1 oz (35μm) all layers
Minimum Trace/Space	8/7 mils
Minimum Hole Size	0.5mm
Via Count	23
Surface Finish	Immersion Gold
Solder Mask	Green (Top only)

3. Engineering Features & Applications
Advanced Material Properties
High Thermal Stability: Decomposition temperature >500°C
Environmental Resistance: Only 0.05% moisture absorption
Consistent Performance: Tight Dk and thickness tolerances
Reliable Interconnects: Excellent plated through-hole quality

Board Configuration
Component Support: 29 components (38 thru-hole, 16 SMT)
Panel Design: Two different designs per panel
File Compatibility: Gerber RS-274-X format
Quality Assurance: 100% electrical testing


Target Applications
Satellite Communications: Compact antenna arrays
Radar Systems: Collision avoidance and warning systems
RF Power Amplifiers: Efficient signal amplification
Military Electronics: Secure communication devices

Why Choose This PCB?
1. Circuit Miniaturization: High Dk enables smaller designs
2. X-Band Performance: Optimized for frequencies up to 12GHz
3. Robust Construction: 1.3mm thickness for mechanical durability
4. Manufacturing Consistency: Tight material tolerances ensure reliability


Order Your Custom RF Solution
Contact our engineering team for specialized configurations or production quotes. Ideal for applications requiring compact size without compromising RF performance.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.