RO3035 High-Frequency PCB - 0.8mm Double-Sided Board with 94V0

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3035
• Model NO.: BIC-1023-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO3035 High-Frequency PCB - 0.8mm Double-Sided Board with 8/11 mil Trace/Space for 5G & Radar Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Premium RF Circuit Board Solution
Engineered for next-generation wireless applications, this double-sided PCB leverages Rogers RO3035 high-frequency laminate to deliver outstanding signal integrity and thermal stability. Designed for 5G infrastructure, automotive radar, and satellite systems, this 0.8mm thick circuit board combines ceramic-filled PTFE performance with cost-effective manufacturability.

Standout Features:
Exceptional Signal Clarity: 0.0015 ultra-low dissipation factor at 10GHz
Thermal Reliability: Stable up to 500°C decomposition temperature
Precision Engineering: 8/11 mil trace/space with 0.3mm microvias
Optimal Surface Treatment: Immersion gold finish for superior conductivity

2. Technical Specifications

Characteristic	Value
Core Material	RO3035 Ceramic-Filled PTFE
Board Configuration	Double-Layer
Panel Dimensions	195mm × 98mm (±0.15mm)
Overall Thickness	0.8mm (30mil dielectric)
Conductive Layers	35μm Electrolytic Copper
Minimum Feature Size	8/11 mils Trace/Space
Via Specifications	78 plated through holes
Surface Treatment	Immersion Gold (ENIG)
Quality Certification	IPC-Class-2 Standards

3. Advanced Engineering Attributes
Material Advantages
Frequency-Stable Performance: 3.5±0.05 dielectric constant maintained from RF to millimeter-wave
Environmental Resilience: Mere 0.04% moisture absorption
Thermal Management: 0.5 W/m/K conductivity with copper-matched CTE

Design Capabilities
Component Integration: Supports 71 devices (78 thru-hole, 39 SMT)
High-Density Layout: 117 total contact points across 15 networks
Manufacturing Ready: Gerber RS-274-X file compatibility
Global Production: Worldwide fabrication availability

Target Implementations
5G Network Equipment: Massive MIMO antennas and RF frontends
Automotive Safety Systems: 77GHz collision avoidance radar
Satellite Technology: High-frequency transceivers and LNBs
IoT Infrastructure: Smart grid monitoring devices

Competitive Edge:
1. Millimeter-Wave Ready for frequencies up to 40GHz
2. Cost-Efficient alternative to conventional PTFE materials
3. Exceptional Durability with copper-matched expansion
4. Simplified Integration with hybrid multilayer designs

Request Your Custom RF Solution
Our engineering team stands ready to adapt this platform to your specific requirements, offering global manufacturing support and technical consultation for your high-frequency projects.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.