Blind Via PCB Fr-4 with Immersion Gold

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0310-V3.10
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Final Foil External
35 Um
Innner Copper Thick
1/1 Oz
Final Height of PCB
1.6+/-0.16%mm
Surface Finish
Enig,Nickel ≧120u′′ ,Gold ≧1.2u′′
Solder Mask Color
Green
Colour of Component Legend
White
Via
Via Tented.
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
211 x 99.5mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534001000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of 6 layer printed circuit board built on FR-4 Tg170 substrate for
the application of SAN Storage. It's 1.6 mm thick with white silkscreen on green
solder mask and immersion gold on pads. The base material is from Shengyi and
supplying 30 up boards per panel. They're fabricated per IPC 6012 Class 2 using
supplied Gerber data. Each 25 panels are packed for shipment. 

1.2 Features and benifits
    
A. RoHS compliant and suitable for high thermal reliability needs
B. High solderability, no stressing of circuit boards and less contamination of
     PCB surface.
C. AOI inspection
D. Delivery on time. Higher than 98% on-time-delivery rate.
E. RoHS materials
F. Quick turn-around samples
    
1.3 Application
    
GPS, Security System, Solar Led Lights, Waterproof Led Lights, Wireless Connection,
1500 Watt Inverter, Access Systems, 220V Inverter, Embedded Solutions, Automobile

1.4 Parameter and data sheet
Item Description Content
Board type Multilayer PCB Multilayer PCB Board
Board size 109.86 X 248.6mm=20up 109.86 X 248.6mm=30up
Layer count 6 layer 6 layer
Laminate Laminate Type FR4:TG170
Supplier SHENGYI
Tg TG 170
Finished thickness 1.6+/-0.16% MM
Plating Thickness PTH Cu thickness 20um
Inner layer Cu Thickness 1/1 OZ
Surface Cu thickness 35 um
Solder  Mask Material type LP-4G G-05
Supplier Nan Ya
Color Green
Single / both sides Both Sides
S/M thickness >+ 10.0 um
3M tape test NO Peel  Off
Legend Material type S-380W
Supplier Tai yo
Color White
Location CS
3M tape test No peel off
Circuit Trace Width (mm) 0.177+/-20%mm
Spacing (mm) 0.203+/- 20%mm
Identification UL mark 94V-0
Company Logo QM2
Date code 1217
Mark location CS
Surface Treatment ENIG Nickel >=120U''
Gold >=1.2U''
Reliabilty Tests Thermal shock test 288±5ºC, 10sec ,3 cycles
solder abllity test 245±5ºC
Function Electrioal Test 100%
Standard IPC-A 600H class 2, 
IPC_6012C CLASS 2
  100%
Appearance Visual inspection 100%
warp and twist <= 0.75%
Others V-Cut  thickness 0.4±0.1 mm
Angle 30+/- 5
Drill table (mm) No  PTH/NPTH Size
1 Y 0.356+/-0.075
2 Y 0.457+/-0.075
3 N 0.5+/-0.05
4 Y 0.610+/-0.075
5 Y 0.813+/-0.075
6 Y 0.850+/-0.075
7 Y 0.914+/-0.075
8 Y 1.016+/-0.075
9 Y 1.118+/-0.075
10 Y 1.321+/-0.075
11 Y 1.600+/-0.075
12 Y 1.702+/-0.075
13 Y 2.032+/-0.075
14 Y 2.540+/-0.075
15 N 3.5+/-0.05




 

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