China PCB|Printed Circuit board PCB|PCB Supplier

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC1307R3.8
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Surface Finish: Immersion Gold
• Board Thick: 1.53mm
• Outer Copper Foil: 42.02 Um(1 Oz)
• Min Line Width (Mil): 6.7 Mil
• Min Line Spacing (Mil): 10.6 Mil
• Solder Mask Color: Black
• Legend Color: White
• Forming: V-Cut
• Warp-Twist: 0.51%
• Electrical Test: 100% PCB Passed
• Transport Package: Vacuum
• Specification: 119.00*98.00mm=4pcs
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 PCS/ Month

Product Description

China PCB 2 Layer copper board 1 oz Black soldermask with Immersion Gold


Commodity Introduction
This is a type of FR-4 PCB for the application of CODEC. It's a 2 layer board at 1.6mm thick.
The base laminate is from ITEQ, Solder mask from KUNG SHUN. It's fabricated per IPC 6012
Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately. 


Parameters & Data Sheet

Item		Requirement	Result
Laminate	Type	FR-4	FR-4
	Supplier	ITEQ	ITEQ
	Board thickness	1.60±10% mm	1.53-1.62 mm
	Outer copper foil	>=35 um	42.02um
	Inner copper foil	/	/
	Warp-twist	<= 0.75%	0.51%
Legend	Type	KUANG SHUN	KUANG SHUN
	Color	White	White
	Location	CS	CS
Marking	Co.logo	YES	OK
	UL.logo	YES	OK
	Date code	WWYY	WWYY
	Marking form	NA	OK
	Location	CS	CS
Min line width (mil)		6.5	6.7
Min line spacing (mil)		10.8	10.6
Min ring width (mil)		NA	NA
Solder Mask	Type	KSM-S6189BK31	KSM-S6189BK31
	Color	Black	Black
	Thickness	>=10 um	14 um
	Pencil Test	6H OR ABOVE	OK
	SOLVENT TEST	NO ATTACK	OK
	TAPE TEST	NO PEEL OFF	OK
Surface Teament	Immersion Gold		OK
Special Treament	Silk screen	/	/
	Location	/	/
	Forming	V-cut	OK
Normal Testing	Electrical test	100% PCB passed	OK
	Visual inspection	IPC-A-600H&IPC-6012B	OK
	Solderability Test	245ºC 5S 1 Cycle	OK

PCB Capability 
More than 14 years of PCB experiences
Excellent after-sales service
Substrate material: Epoxy glass (FR-4), High frequency, Metal core
Price advantages on circuit boards
Multilayer PCB and Hybrid material of Multilayer PCB
Focus on prototypes, small batches and volume production
TS16949 (2009), ISO14001 (2004), ISO9001 (2008), UL certified
 

Printed Circuit Board Capability
Parameter	Value
Layer Counts	1-32
Substrate Material	FR-4(including High Tg 170, High CTI>600V);  Aluminum based ; RO4350B, RO4003C;  94HB and FR-1 (upon request)
Maximum Size	Flying test: 900*600mm, Fixture test 460*380mm,  No test  1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t<0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--420µm (0.5oz - 12oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin, Imm Ag, OSP, Gold Finger