F4btms615 PCB Board at Low Electronic Components Price for Aerospace

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-110-V2.1
• Material: PTFE Fiberglass Ceramic
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: F4btms615
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Wangling
• Solder Mask: Black
• Surface Finish: Immersion Gold
• Layer Count: 2-Layer
• Series: F4btms Series PCB
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 171 x 58mm=1PCS
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Wangling F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate for Aerospace

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Brief Introduction
This printed circuit board (PCB) is designed as a double-sided board with two layers of copper, features a compact size of 171 mm x 58 mm. It supports surface mount components on top side. The layer stackup consists of a top layer with 35 µm (1 oz) copper starting with half ounces plating, supported by a durable F4BTMS615 core material with a thickness of 1.524 mm in the middle. This PCB uses Immersion Gold and black solder mask applied to the top side.

Here are more details in the table below.

F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold
PCB SIZE	171 x 58mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 35 um(0.5 oz+plate) TOP layer
	F4BTMS615 -1.524 mm
	copper ------- 35 um(0.5 oz + plate)  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7 mil / 6 mil
Minimum / Maximum Holes:	0.5 mm / 1.5 mm
Number of Different Holes:	5
Number of Drill Holes:	27
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	F4BTMS615 Dk6.15
Final foil external:	1oz
Final foil internal:	N/A
Final height of PCB:	1.6 mm ±10%
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	Top, Black
Solder Mask Color:	no
Solder Mask Type:	no
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top
Colour of Component Legend	White
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

F4BTMS High Frequency Material
The F4BTMS series is an upgraded version of the F4BTM series. Building upon its foundation, significant technological advancements have been made in material formulation and manufacturing processes. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants. It is a high-reliability material suitable for aerospace applications, capable of replacing similar foreign products. 
  
By incorporating a small amount of ultra-thin and ultra-fine fiberglass cloth reinforcement, along with a significant and uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the fiberglass effect during the propagation of electromagnetic waves is minimized, reducing dielectric loss and enhancing dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. The material also possesses excellent low coefficient of thermal expansion and stable dielectric temperature characteristics. 
  
The F4BTMS series comes standard with RTF low roughness copper foil, which not only reduces conductor loss but also provides excellent peel strength. It can be paired with copper-based or aluminum-based options.

Features
 

1. Minimal dielectric constant tolerance and excellent batch-to-batch consistency.
2. Extremely low dielectric loss.
3. Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.
4. Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.
5. Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.
6. Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.
7. Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.
8. Improved thermal conductivity, suitable for high-power applications.
9. Excellent dimensional stability.
10. Low water absorption.

Data Sheet (F4BTMS)

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/ºC	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Surface Resistivity	Standard Condition	MΩ	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Electrical Strength (Z direction)	5KW,500V/s	KV/mm	>26	>30	>32	>34	>40	>40	>42	>44	>45	>48	>23
Breakdown Voltage (XY direction)	5KW,500V/s	KV	>35	>38	>40	>42	>48	>52	>55	>52	>54	>55	>42
Coefficientof Thermal Expansion (X, Y direction)	-55 º~288ºC	ppm/ºC	40, 50	35, 40	15, 20	15, 20	10, 12	10, 11	10, 12	13, 12	12, 12	10, 12	16, 18
Coefficientof Thermal Expansion (Z direction)	-55 º~288ºC	ppm/ºC	290	220	80	72	22	22	20	47	45	40	32
Thermal Stress	260ºC, 10s,3 times	/	No delamination
Water Absorption	20±2ºC, 24 hours	%	0.02	0.02	0.025	0.025	0.02	0.025	0.03	0.08	0.08	0.1	0.03
Density	Room Temperature	g/cm3	2.18	2.22	2.26	2.26	2.25	2.28	2.3	2.51	2.53	2.75	3.2
Long-Term Operating Temperature	High-Low Temperature Chamber	ºC	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260
Thermal Conductivity	Z direction	W/(M.K)	0.26	0.28	0.31	0.36	0.58	0.58	0.6	0.63	0.64	0.67	0.81
Flammability	/	UL-94	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0
Material Composition	/	/	PTFE,Ultra-thin and ultra-fine (quartz) fiberglass.		PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.

Our PCB Capability (F4BTMS)

PCB Capability (F4BTMS)
PCB Material:	PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.
Designation                        (F4BTMS )	F4BTMS	DK (10GHz)	DF (10 GHz)
	F4BTMS220	2.2±0.02	0.0009
	F4BTMS233	2.33±0.03	0.0010
	F4BTMS255	2.55±0.04	0.0012
	F4BTMS265	2.65±0.04	0.0012
	F4BTMS294	2.94±0.04	0.0012
	F4BTMS300	3.0±0.04	0.0013
	F4BTMS350	3.5±0.05	0.0016
	F4BTMS430	4.3±0.09	0.0015
	F4BTMS450	4.5±0.09	0.0015
	F4BTMS615	6.15±0.12	0.0020
	F4BTMS1000	10.2±0.2	0.0020
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness	0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..