Black Gold Prototype PCB 10 Layer 1.6mm Thick with 6up per Panel V-cut and Immersion
Gold for volume Production in Wireless Speakers
Commodity Introduction
This is a type of FR-4 PCB for the application of Wireless Speakers. It's a 10 layer board at 1.6mm
thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per
IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Parameters & Data Sheet
| Item |
Requirement |
Result |
| Laminate |
Type |
FR-4 |
FR-4 |
| Supplier |
ITEQ |
ITEQ |
| Board thickness |
1.6+/0.1%mm |
1.64-1.65mm |
| Outer copper foil |
>=35 um |
44.31um |
| Inner copper foil |
H/H OZ |
H/H OZ |
| Warp-twist |
<= 0.75% |
0.24% |
| Legend |
Type |
TAIYO |
TAIYO |
| Color |
White |
White |
| Location |
CS & SS |
CS & SS |
| Marking |
Co.logo |
As requirement |
OK |
| UL.logo |
As requirement |
OK |
| Date code |
As requirement |
OK |
| Marking form |
As requirement |
OK |
| Location |
CS |
CS |
| Min line width (mil) |
6 |
6.2 |
| Min line spacing (mil) |
4.5 |
4.3 |
| Min ring width (mil) |
NA |
NA |
| Solder Mask |
Type |
KSM-S6189BK31 |
KSM-S6189BK31 |
| Color |
Black |
Black |
| Thickness |
>=10 um |
13 um |
| Pencil Test |
6H OR ABOVE |
OK |
| SOLVENT TEST |
NO ATTACK |
OK |
| TAPE TEST |
NO PEEL OFF |
OK |
| Surface Treament |
Immersion Gold |
OK |
| Special Treament |
Silk screen |
/ |
/ |
| Location |
/ |
/ |
| Forming |
V-cut |
OK |
| Normal Testing |
Electrical test |
100% PCB passed |
OK |
| Visual inspection |
IPC-A-600H&IPC-6012C |
OK |
| Solderability Test |
245ºC 5S 1 Cycle |
OK |
Finished dimension (unit: mm): including v-cut
| No |
Required Dimension (tolerance) |
Actual Dimension |
| 1 |
100.00 |
99.88 |
100.08 |
99.98 |
99.93 |
| 2 |
100.00 |
100.09 |
99.99 |
9.94 |
100.00 |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
| No |
Required |
PTH |
Actual Dimension |
| 1 |
0.750 |
Y |
0.750 |
0.725 |
0.775 |
0.750 |
| 2 |
1.000 |
Y |
1.000 |
0.975 |
1.025 |
1.000 |
| 3 |
0.700 |
N |
0.700 |
0.675 |
0.725 |
0.700 |
| 4 |
2.000 |
N |
2.000 |
1.975 |
2.025 |
2.000 |
| 5 |
4.000 |
N |
4.000 |
3.975 |
4.025 |
4.000 |
Learn PCB and Buy PCB
The process of multilayer PCB
A) In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but
drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.
B) Layers from top to bottom are bonded together in close registration by means of thin plies of
prepreg. The bonding is performed under close temperature and pressure control in a lamination
press.
C) After lamination, they are the processed in very much the same way as an ordinary double
-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop
the circuit pattern.Solder masks are applied and solder coating (HAS, ENIG etc) is performed.
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