Double Sided PCB with Black Mask and Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0344-V3.44
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Foil External: 35 Um (1 Oz)
• Final Height of PCB: 1.6 mm ±0.16
• Surface Finish: Immersion Gold
• Solder Mask Color: Black
• Colour of Component Legend: N/a
• Mininum Trace (Mil): 5.8 Mil
• Minimum Gap(Mil): 5.2 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 140.26 x 110.40mm=5UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 2 layer PCB board built on FR-4 Tg135 substrate for the application of security
system. It's 1.6 mm thick with white silkscreen on black solder mask and immersion gold on pads.
The base material is from ITEQ supplying 5 up boards per panel. They're fabricated per IPC 6012
Class 2 using supplied Gerber data. Each 25 panels are packed for shipment. 

1.2 Features and benifits    
    
A. RoHS compliant and suitable for thermal reliability needs
B. Excellent surface planarity for CSP mounted components to reduce failure rate during assembly
and soldering.
C. Electrical test and  high voltage test
D. Products and Manufacturing are certified by authorized organizations.
E. Quick Lead time: 3-5 days
F. Prototype PCB capability

1.3 Application
    
HDMI Splitter, Signal Booster, Yagi Antenna, Electronic Lock, Long Range WiFi,    3G Repeater,
Umts Modem, Biometric Access Control System, Application Of Embedded System, Coffee
makers

1.4 Parameter and data sheet

Number of Layers	2
Board Type	Double sided PCB
Board Size	140.26 x 110.40mm=5UP
Board Thickness	1.6mm +/-0.16
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, KSM-S6189BK31
Solder Mask Supplier	KUANGSHUN
Solder Mask Colour	Black
Number of Solder Masks	2
Thickness of Solder Mask	14um
Type of Silkscreen Ink	n/a
Supplier of Silkscreen	n/a
Color of Silkscreen	n/a
Number of Silkscreen	n/a
Mininum Trace (mil)	5.8 mil
Minimum Gap(mil)	5.2 mil
Surface Finish	Immersion gold, 0.025u" gold over 4.15u" nickel
RoHS Required	Yes
Warpage	0.32%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.3
	T2: 3.2

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