Heavy Copper PCB Built on Aluminum Core  with 6 Oz

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0505-V3.0
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
OSP
Base Material
Copper Clad Laminate
Insulation Materials
Epoxy Resin
Brand
Bicheng
Transport Package
Vacuum
Specification
99 X 90mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
50000 Pieces Per Month

Product Description

General Profile

PCB copper foil with a nominal thickness of over 105 μm is generally referred to as a heavy copper foil or thick copper foil. Printed circuit boards made of heavy copper foil and super-thick copper foil can be called heavy copper printed circuit boards or thick copper PCB. The applications and demands of heavy copper PCB have been rapidly expanded in recent years, making it become a kind of "hot" PCB variety with a very good market prospects.

Features
1) The copper weight of the track ≥105μm
2) The most designs are plane winding coil of wire
3) Withstand high current and have good heat dissipation

Typical Applications
1) Power convertion module boards which are used in automotive electronics and electric equipment;
2) DC-DC converters for hybrid electric vehicles;
3) Power electronics technology

PCB Products
1) FR-4 up to 12oz (420μm)
2) Metal core up to 10oz(350μm)
3) Ceramic core up to 10oz(μm)
Printed Circuit Board Capability
Parameter Value
Layer Counts 1-32
Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; Polyimide, 94HB and FR-1 (upon request)
Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
Board Outline Tolerance ±0.0059" (0.15mm)
PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) ±8%
Thickness Tolerance(t<0.8mm) ±10%
Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track 0.003" (0.075mm)
Minimum Space 0.003" (0.075mm)
Outer Copper Thickness 35µm--420µm (1oz-12oz)
Inner Copper Thickness 17µm--420µm (0.5oz - 12oz)
Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
Registration (Mechanical) 0.00197" (0.05mm)
Aspect Ratio 12:1
Solder Mask Type LPI
Min Soldermask Bridge 0.00315" (0.08mm)
Min Soldermask Clearance 0.00197" (0.05mm)
Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance ±10%
Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

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