TC350 Rogers RF PCB Built on 30mil Double Sided Corel With Immersion Gold for Tower Mounted Amplifiers
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
The TC350 by Rogers is a composite material made up of woven fiberglass for reinforcement, ceramic for filling, and a PTFE base, all of which are utilized in the creation of printed circuit boards. TC350 is designed in such a way that it can achieve enhanced heat - transfer with its remarkable "Best - In - Class" thermal conductivity. At the same time, it is formulated to decrease dielectric loss and insertion loss. As a result of these reduced losses, amplifier and antenna gains are increased, and efficiencies are improved.
Features and Benefits:
1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.
2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.
3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.
Our PCB Capability (TC350)
| Our PCB Capability (TC350) |
| PCB Material: |
Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
| Designation: |
TC350 |
| Dielectric constant: |
3.5±0.05 |
| Thermal Conductivity |
0.72 W/m-K |
| Dissipation Factor |
Df .002@10 GHz |
| Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid PCB |
| Copper weight: |
1oz (35µm), 2oz (70µm) |
| PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.. |
Some Typical Applications:
1. Microwave Combiner and Power Dividers
2. Power Amplifiers, Filters and Couplers
3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
4. Thermally Cycled Antennas sensitive to dielectric drift
Typical Properties of TC350:
| Typical Properties:TC350 |
| Property |
Units |
Value |
Test Merthod |
| 1. Electrical Properties |
|
| Dielectric Constant (may vary by thickness) |
|
|
|
| @1 MHz |
- |
3.50 |
IPC TM-650 2.5.5.3 |
| @1.8 GHz |
- |
3.50 |
RESONANT CAVITY |
| @10 GHz |
- |
3.50 |
IPC TM-650 2.5.5.5 |
| Dissipation Factor |
|
|
|
| @1 MHz |
- |
0.0015 |
IPC TM-650 2.5.5.3 |
| @1.8 GHz |
- |
0.0018 |
RESONANT CAVITY |
| @10 GHz |
- |
0.0020 |
IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric |
- |
|
|
| TC r @ 10 GHz (-40-150°C) |
ppm/ºC |
-9 |
IPC TM-650 2.5.5.5 |
| Volume Resistivity |
|
|
|
| C96/35/90 |
MΩ-cm |
7.4x106 |
IPC TM-650 2.5.17.1 |
| E24/125 |
MΩ-cm |
1.4x108 |
|
| Surface Resistivity |
|
|
|
| C96/35/90 |
MΩ |
3.2x107 |
IPC TM-650 2.5.17.1 |
| E24/125 |
MΩ |
4.3x108 |
IPC TM-650 2.5.17.1 |
| Electrical Strength |
Volts/mil (kV/mm) |
780 (31) |
IPC TM-650 2.5.6.2 |
| Dielectric Breakdown |
kV |
40 |
IPC TM-650 2.5.6 |
| Arc Resistance |
sec |
>240 |
IPC TM-650 2.5.1 |
| 2.Thermal Properties |
|
| Decomposition Temperature (Td) |
|
|
|
| Initial |
°C |
520 |
IPC TM-650 2.4.24.6 |
| 5% |
°C |
567 |
IPC TM-650 2.4.24.6 |
| T260 |
min |
>60 |
IPC TM-650 2.4.24.1 |
| T288 |
min |
>60 |
IPC TM-650 2.4.24.1 |
| T300 |
min |
>60 |
IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC |
ppm/ºC |
7, 7 |
IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC |
ppm/ºC |
23 |
IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) |
% |
1.2 |
IPC TM-650 2.4.24 |
| 3. Mechanical Properties |
|
| Peel Strength to Copper (1 oz/35 micron) |
|
|
|
| After Thermal Stress |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) |
lb/in (N/mm) |
9 (1.6) |
IPC TM-650 2.4.8.2 |
| After Process Solutions |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
| Young's Modulus |
kpsi (MPa) |
|
IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) |
kpsi (MPa) |
14/10 (97/69) |
IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) |
kpsi (MPa) |
11/8 (76/55) |
IPC TM-650 2.4.18.3 |
| Compressive Modulus |
kpsi (MPa) |
|
ASTM D-3410 |
| Poisson's Ratio |
- |
|
ASTM D-3039 |
| 4. Physical Properties |
|
| Water Absorption |
% |
0.05 |
IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC |
g/cm3 |
2.30 |
ASTM D792 Method A |
| Thermal Conductivity |
W/mK |
0.72 |
ASTM D5470 |
| Specific Heat |
J/gK |
0.90 |
ASTM D5470 |
| Flammability |
class |
V-0 |
UL-94 |
| NASA Outgassing, 125ºC, ≤10- 6 torr |
|
|
|
| Total Mass Loss |
% |
0.02 |
NASA SP-R-0022A |
| Collected Volatiles |
% |
0.01 |
NASA SP-R-0022A |
| Water Vapor Recovered |
% |
0.01 |
NASA SP-R-0022A |
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