Multilayer Flexible Pcbs 94V0 Rigid-Flex Pcbs FPC

• Customization: Available
• Structure: Multilayer FPC
• Material: Polyimide
• Model NO.: BIC-0416-V4.16
• Combination Mode: Adhesive Flexible Plate
• Application: Digital Products, Mobile Phone, Aviation and Aerospace
• Conductive Adhesive: Conductive Silver Paste
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Height of PCB: 1.0mm
• Final Foil External: 35 µm
• Inner Iayer Cu Thicknes: 35 µm
• Surface Finish: Immersion Gold
• Coverlay Colour: Yellow Coverlay / Green Solder Mask
• Color of Silkscreen: White
• RoHS Required: Yes
• Function: 100% Pass Electrical Test
• Transport Package: Transparent Bags
• Specification: 20.61 X 50.17mm
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 Pieces Per Month

Product Description

1.1 General description

This is a type of Rigid flex PCB for the application of Micro USB. It's a 4 layer rigid-flex board
at 1.0mm thick. The base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2 using
supplied Gerber data.

1.2 Features and benifits

A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. No minimum order quantity and low cost sample.
L. Delivery on time. We keep higher than 98% on-time-delivery rate.

1.3 Application

Contact belt of inkjet printer, Industrial surveying and mapping instrument, Tablet PC camera
soft board

1.4 Parameter and data sheet

Parameter & Data Sheet
Size of Flexible PCB	20.61 X 50.17mm
Number of Layers	4
Board Type	Rigid flex PCB
Board Thickness	1.0mm
Board Material	1.0mm FR-4 / Polyimide 25µm
Board Material Supplier	ITEQ
Tg Value of Board Material	60ºC
PTH Cu thickness	≥20 µm
Inner Iayer Cu thicknes	35 µm
Surface Cu thickness	35 µm
Coverlay Colour	Yellow coverlay / Green solder mask
Number of Coverlay	2
Thickness of Coverlay	25 µm
Stiffener Material	no
Stiffener Thickness	N/A
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Peeling test of Coverlay	No peelable
Legend Adhesion	3M 90ºC No peeling after Min. 3 times test
Surface Finish	Immersion Gold
Thickness of Nickle/Gold	Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required	Yes
Famability	94-V0
Thermal Shock Test	Pass, -25ºC±125ºC, 1000 cycles.
Thermal Stress	Pass, 300±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 2

Main flexible PCBs

Disposal prior to Solder mask