RO4534 Antenna PCB - 1.6mm Double-Sided Board with 4/4 Mil Trace/Space for Cellular Infrastructure

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4534
• Model NO.: BIC-1026-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO4534 Antenna PCB - 1.6mm Double-Sided Board with 4/4 mil Trace/Space for Cellular Infrastructure
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Advanced Antenna Circuit Board Solution
Engineered specifically for modern antenna applications, this double-sided PCB utilizes Rogers RO4534 high-frequency laminate to deliver optimal RF performance and cost efficiency. Designed for cellular infrastructure and WiMAX networks, this 1.6mm thick board features superior passive intermodulation (PIM) characteristics (-157 dBC typical) and excellent dimensional stability for large panel processing.

Key Advantages:
Antenna-Optimized Performance: 3.4 dielectric constant with 0.0027 low loss
Manufacturing Efficiency: Compatible with standard FR-4 processing
Reliable Construction: 161 resin-filled vias (IPC-4761 Type VII)
Thermal Management: CTE matched to copper (11/14 ppm/°C X/Y)

2. Technical Specifications

Parameter	Specification
Base Material	Rogers RO4534
Layer Configuration	Double-Sided
Board Dimensions	170.66mm × 70.33mm (±0.15mm)
Finished Thickness	1.6mm (60mil dielectric)
Copper Weight	1 oz (35μm) all layers
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.4mm
Via Treatment	0.4mm resin-filled & capped
Surface Finish	Immersion Gold
Solder Mask	Green (Top & Bottom)
Component Density	173 components (121 thru-hole, 79 SMT)

3. Engineering Features & Applications
Material Superiority
Exceptional PIM Performance: -157 dBC for clean signal transmission
Thermal Reliability: >280°C Tg withstands lead-free processing
Environmental Resistance: 0.06% moisture absorption
Dimensional Stability: Maintains form during large-panel fabrication

Design Capabilities
High-Density Layout: 200 pads across 23 networks
Precision Manufacturing: 4/4 mil trace/space technology
File Compatibility: Gerber RS-274-X format
Global Production: Worldwide manufacturing support


Target Applications
5G Infrastructure: Massive MIMO antenna arrays
Wireless Networks: WiMAX and cellular base stations
RF Antennas: High-performance directional arrays
Telecom Equipment: Compact antenna solutions

Why Choose This PCB?
1. Antenna-Specific Design with optimized PIM characteristics
2. Cost-Effective Alternative to traditional PTFE materials
3. High-Yield Manufacturing for large panel processing
4. Thermally Stable for reliable field performance

Order Your Custom Antenna Solution
Contact our RF engineering team to adapt this platform for your specific antenna requirements, with global manufacturing support and technical consultation available.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.