| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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RF - 60A laminates fully comply with RoHS and WEEE directives and are suitable for the temperatures demanded by new lead - free solders. They can be processed through shearing, drilling, milling, and plating using standard techniques for PTFE - woven fiberglass materials, thus enabling mass production.
| Our PCB Capability (RF-60A) | |
| PCB Material: | Organic-ceramic Woven Fiberglass Reinforced Laminates |
| Designation: | RF-60A |
| Dielectric constant: | 6.15 ±0.25 |
| Dissipation Factor | DF 0.0038@10 GHz |
| Thermal Conductivity | 0.4 W/MK |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
| RF-60A Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.6 | 6.15 | 6.15 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 | 0.0038 | 0.0038 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | 53 | kV | 53 |
| Dielectric Strength | ASTM D 149 | V/mil | 880 | kV/mm | 35 |
| Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 9.0 x 108 | Mohm/cm | 9.0 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 2.28 x 108 | Mohm | 2.28 x 108 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 193 | Seconds | 193 |
| Flexural Strength (MD) | ASTM D 790 | psi | 18,300 | N/mm2 | 126.2 |
| Flexural Strength (CD) | ASTM D 790 | psi | 14,600 | N/mm2 | 100.7 |
| Tensile Strength (MD) | ASTM D 3039 | psi | 19,500 | N/mm2 | 134.4 |
| Tensile Strength (CD) | ASTM D 3039 | psi | 16,300 | N/mm2 | 112.4 |
| Young's Modulus | ASTM D 3039 | kpsi | 1,590 | N/mm2 | 11,000 |
| Poisson's Ratio | ASTM D 3039 | 0.068 | N/mm2 | 0.068 | |
| Compressive Modulus | ASTM D 695 (23°C) | kpsi | 338 | 2,330 | |
| Peel Strength (1 oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 8 | N/mm | 1.4 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.68 | mm/M | 0.68 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 1.05 | mm/M | 1.05 |
| Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.79 | g/cm3 | 2.79 |
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.4 | W/M*K | 0.4 |
| CTE (X axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 9 | ppm/°C | 9 |
| CTE (Y axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 8 | ppm/°C | 8 |
| CTE (Z axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 69 | ppm/°C | 69 |
| Outgassing (% TML) | ASTM E 595* | % | 0.02 | % | 0.02 |
| Outgassing (% CVCM) | ASTM E 595* | % | 0.00 | % | 0.00 |
| Outgassing (% WVR) | ASTM E 595* | % | 0.01 | % | 0.01 |
| Flammability Rating | UL 94 | V-0 | V-0 | ||
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