F4btms1000 High Frequency PCB Wholesale Electronics PCB Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: F4btms1000
• Model NO.: BIC-113-V2.1
• Material: PTFE
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Wangling
• Application: Aerospace
• Thickness: 3.2mm
• Surface Finish: Immersion Gold
• Copper Weight: 2oz
• Layer Count: 2-Layer
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 215 x 145mm=1PCS
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

3.2mm F4BTMS1000 High Frequency PCB DK10.2 PTFE Substrates  for Aerospace Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Brief Introduction
This Double-sided PCB features circuitry on both the top and bottom layers, each with a copper weight of 2oz. The middle layer consists of an F4BTMS1000 core, measuring 3.175 mm in thickness. The PCB size is 215mm x 145mm, with a single unit in the panel. It is equipped with surface mount components and does not include any through-hole components. The surface finish is Immersion Gold, and a black solder mask is applied to the top side of the PCB. Prior to shipment, a comprehensive 100% Electrical Test is carried out to ensure functionality and uphold quality standards.

Here are the details in table below.

F4BTMS1000 High Frequency PCB High DK10.2 PTFE 3.2mm Substrates with Immersion Gold
PCB SIZE	215 x 145mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 70 um(1 oz+plate) TOP layer
	F4BTMS1000 -3.175 mm
	copper ------- 70 um(1 oz + plate)  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	12 mil / 12 mil
Minimum / Maximum Holes:	0.6 mm / 3.0 mm
Number of Different Holes:	6
Number of Drill Holes:	36
Number of Milled Slots:	1
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	F4BTMS1000 Dk10.2
Final foil external:	2oz
Final foil internal:	N/A
Final height of PCB:	3.2 mm ±10%
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	Top, Black
Solder Mask Color:	no
Solder Mask Type:	no
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top
Colour of Component Legend	White
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), minimum size 0.6mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

F4BTMS High Frequency Laminate
The F4BTMS series is an upgraded version of the F4BTM series. Building upon its foundation, significant technological advancements have been made in material formulation and manufacturing processes. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants. It is a high-reliability material suitable for aerospace applications, capable of replacing similar foreign products. 
  
By incorporating a small amount of ultra-thin and ultra-fine fiberglass cloth reinforcement, along with a significant and uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the fiberglass effect during the propagation of electromagnetic waves is minimized, reducing dielectric loss and enhancing dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. The material also possesses excellent low coefficient of thermal expansion and stable dielectric temperature characteristics. 

The F4BTMS series comes standard with RTF low roughness copper foil, which not only reduces conductor loss but also provides excellent peel strength. It can be paired with copper-based or aluminum-based options.
 

Features
Small dielectric constant tolerance and good consistency between batches;
Ultra-low dielectric loss;
It has stable dielectric constant and low loss value when the operating frequency is within 40G, which can meet the phase-sensitive application;
The change coefficient of dielectric constant and dielectric loss with temperature is excellent, maintaining excellent frequency stability and phase stability between - 55 ºC and 150 ºC;
Excellent radiation resistance. After the dose irradiation treatment, it still maintains stable dielectric and physical properties.
Low exhaust performance, tested according to the standard method of material volatilization performance under vacuum conditions, meets the requirements of vacuum exhaust for aerospace;
The thermal expansion coefficient of material in X/Y/Z direction is small; The dimensional thermal stability and the reliability of pore copper are guaranteed;
Better thermal conductivity, suitable for high-power applications.
Excellent dimensional stability;
Low water absorption.

Typical Applications
- Aerospace equipment, space and cabin equipment
- Microwave and RF
- Radar and military radar
- Feed network
- Phase-sensitive antenna and phased array antenna
- Satellite communication, etc

Data Sheet (F4BTMS) 

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/ºC	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Surface Resistivity	Standard Condition	MΩ	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Electrical Strength (Z direction)	5KW,500V/s	KV/mm	>26	>30	>32	>34	>40	>40	>42	>44	>45	>48	>23
Breakdown Voltage (XY direction)	5KW,500V/s	KV	>35	>38	>40	>42	>48	>52	>55	>52	>54	>55	>42
Coefficientof Thermal Expansion (X, Y direction)	-55 º~288ºC	ppm/ºC	40, 50	35, 40	15, 20	15, 20	10, 12	10, 11	10, 12	13, 12	12, 12	10, 12	16, 18
Coefficientof Thermal Expansion (Z direction)	-55 º~288ºC	ppm/ºC	290	220	80	72	22	22	20	47	45	40	32
Thermal Stress	260ºC, 10s,3 times	/	No delamination
Water Absorption	20±2ºC, 24 hours	%	0.02	0.02	0.025	0.025	0.02	0.025	0.03	0.08	0.08	0.1	0.03
Density	Room Temperature	g/cm3	2.18	2.22	2.26	2.26	2.25	2.28	2.3	2.51	2.53	2.75	3.2
Long-Term Operating Temperature	High-Low Temperature Chamber	ºC	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260	-55~+260
Thermal Conductivity	Z direction	W/(M.K)	0.26	0.28	0.31	0.36	0.58	0.58	0.6	0.63	0.64	0.67	0.81
Flammability	/	UL-94	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0
Material Composition	/	/	PTFE,Ultra-thin and ultra-fine (quartz) fiberglass.		PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.