Multilayer PCB Built on RO4003c with Immersion Gold and Blind Via

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-GS-0569-V2.0
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Immersion Gold
Base Material
Copper Clad Laminate
Insulation Materials
Epoxy Resin
Brand
Bicheng
Transport Package
Vacuum
Specification
180 X 195mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
50000 Pieces Per Month

Product Description

General profile

Multilayer PCB's represent one of the most complicated products in the PCB industry. A breakdown of a multilayer PCB shows that it consists of three basic elements: thin rigid laminates, prepreg sheet for bonding the laminates and copper foils.

Purpose of Multilayer PCBs
1) To accommodate a larger number of interconnections that steadily increasing use of high pin-count integrated circuits(IC).

2) To establish an electrical performance of the multilayer PCB, such as voltage and ground planes, EMC-shielding and circuit speed etc.

Layer Stackup
The purpose of stackup is to interleave the thin laminates and the prepreg sheets in correct sequence and ensure correct layer-to-layer registration. The stackup of multilayer boards can be done in many different ways.

The process of multilayer PCB 
1) In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched. 

2) Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press. 

3) After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed. 

Thin laminate(base material FR-4)
Vendor Mode Thickness Copper Tg Er
Shengyi S1141 0.05-3.2 mm 17-105 µm ≥130ºC ≤5.4
Shengyi S1170 0.05-3.2 mm 17-105 µm ≥170ºC ≤5.4
ITEQ IT-140 0.05-1.5 mm 17-175 µm ≥135ºC <5.4
ITEQ IT-180 0.05-1.5 mm 17-175 µm ≥170ºC <5.4
ITEQ IT-180A 0.05-1.5 mm 17-175 µm ≥170ºC <5.4

Comparison of different Prepreg
Type of Prepreg Finished thickness Resin Content
  mm mil %
7628H (7630) 0.213 8.4 50
7628(43%) 0.195 7.6 43
7628(41%) 0.185 7.3 41
2116HR 0.135 5.3 57
2116 0.12 4.7 52
2113 0.1 4 56
1080 0.076 3 64
1060 0.05 2 71

 

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