Rogers 4003 60mil 1.524mm Circuit Board RO4003c High Frequency PCB for WLAN

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-007-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Brand: Rogers
• Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers 4003 60mil 1.524mm Circuit Board RO4003C High Frequency PCB Double Sided RF PCB for WLAN
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above.  RO4003C material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4003C material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.  

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range.  RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

PCB Specifications

PCB SIZE	84 x 78mm=1PCS
BOARD TYPE	RF PCB, Microwave PCB
Number of Layers	Double sided PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1oz)+PLATE
	RO4003C 60mil
	copper ------- 35um(1oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:	10mil/12mil
Minimum / Maximum Holes:	0.3/2.3mm
Number of Different Holes:	4
Number of Drill Holes:	155
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	NO
BOARD MATERIAL
Glass Epoxy:	RO4003C 60mil, Tg 288ºC
Final foil external:	1.5oz
Final foil internal:	0oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Electroless nickel over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To:	no Solder mask reqruied
Solder Mask Color:	no solder mask required
Solder Mask Type:	no solder mask reqruied
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	no silkscreen required
Colour of Component Legend	no silkscreen required
Manufacturer Name or Logo:	no silkscreen required
VIA	Plated Through Hole(PTH)
FLAMIBILITY RATING	N/A
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCB DOC etc
SERVICE AREA	Worldwide, Globally.

Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID



Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23ºC 2.5 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 10^10		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 10^9		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150ºC	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/ºC	-55ºCto288ºC	IPC-TM-650 2.4.41
Tg	>280		ºC TMA	A	IPC-TM-650 2.4.24.3
Td	425		ºC TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/^oK	80ºC	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50ºC	ASTM D 570
Density	1.79		gm/cm^3	23ºC	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes