9oz Heavy Copper Aluminum PCB for High Current Application

Product Details
Customization: Available
Type: Rigid Circuit Board
Flame Retardant Properties: V0
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Basic Info.

Model NO.
BIC-0438-V4.38
Dielectric
Aluminum Base 1060
Base Material
Aluminum
Insulation Materials
Metal Composite Materials
Processing Technology
Electrolytic Foil
Application
Consumer Electronics
Mechanical Rigid
Rigid
Material
Aluminum
Aluminum Core
1W / Mk Dielectric Material 75um
Final Foil External
315 Um (9 Oz)
Final Height of PCB
1.20 mm +/-0.1
Surface Finish
OSP
Solder Mask Color
N/a
Colour of Component Legend
N/a
Minimum Trace and Space
16 Mil/14.7 Mil
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
85.00*67.00mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of heavy copper single sided aluminum PCB board at 1.2mm thick for the application
of high current and high temperature dissipation. The base laminate is from ITEQ 9oz Copper. It's
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed
separately.  

1.2 Features and benifits

A. Optimization combination of power circuit and control circuit,
B. Replace the fragile ceramic substrate and obtain a better mechanical durability,
C. Effective heat diffusion in the design of the circuit,
D. Reduce the operating temperature of the equipment, 
E. Improve the power density and reliability of the device, 
F. Prolong the service life of the product,
G. High voltage test, Impedance control test, micro-section, solder-ability test, 
H. Strict WIP inspection and monitoring as well as working instruction, 
I. Right manufacturing instruction (MI), 
J. Great customer service
K. UL conformed
L. Professional and experienced engineers

1.3 Application

Industrial and mining lamps,Automotive ignitor,Security system,audio amplifier

1.4 Parameter and data sheet
Number of Layers 1
Board Type Single Sided PCB
Board Thickness 1.20 mm +/-0.1
Board Material Aluminum PCB, MCPCB
Board Material Supplier ITEQ
Tg Value of Board Material  150ºC
 
PTH Cu thickness N/A
Inner Iayer Cu thicknes N/A
Surface Cu thickness 315 um (9oz)
 
Solder Mask Type and Model No. N/A
Solder Mask Supplier N/A
Solder Mask Colour N/A
Number of Solder Masks N/A
Thickness of Solder Mask N/A
 
Type of Silkscreen Ink N/A
Supplier of Silkscreen N/A
Color of Silkscreen N/A
Number of Silkscreen N/A
 
Mininum Trace (mil) 16 mil
Minimum Gap(mil) 14.7 mil
 
Surface Finish OSP
RoHS Required Yes
Warpage  0.14%
 
Thermal Shock Test Pass, 288±5ºC,10 seconds, 3 cycles. 
No delamination, no blistering.
Solderablity Test Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2

1.5 Outline dimension  Unit: mm
NO. Required Dimension (toerance) Actual dimension
1 85.00  ±0.15 84.99  85.01  85.00  85.01 
2 67.00  ±0.15 67.02  67.01  67.00  66.99 


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