1.1 General description
This is a type of flexible printed circuit for the application of antenna. It's a single layer board
at 0.15mm thick. The base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2 using
supplied Gerber data. 3M tape is applied on the back side, Polyimide as stiffner on the head.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Competitive price
L. Quick Lead time: 3-5 days
1.3 Application
Thin-film switch, Mobile phone battery flex board, Medical keypad soft board
1.4 Parameter and data sheet
| Number of Layers |
1 |
| Board Type |
Flexbile cirucit |
| Board Thickness |
0.15mm +/-10% |
| Board Material |
Polyimide (PI) 25um |
| Board Material Supplier |
ITEQ |
| Tg Value of Board Material |
60ºC |
| |
| PTH Cu thickness |
N/A |
| Inner Iayer Cu thicknes |
N/A |
| Surface Cu thickness |
35 um (1oz) |
| |
| Coverlay Colour |
Yellow |
| Number of Coverlay |
2 |
| Thickness of Coverlay |
25 um |
| Stiffener |
Polyimide 0.3mm |
| |
| Type of Silkscreen Ink |
Taiyo |
| Supplier of Silkscreen |
Taiyo |
| Color of Silkscreen |
White |
| Number of Silkscreen |
1 |
| |
| Mininum Trace (mil) |
20 mil |
| Minimum Gap(mil) |
N/A |
| |
| Surface Finish |
Immersion Gold |
| RoHS Required |
Yes |
| Famability |
94-V0 |
| |
| Thermal Shock Test |
Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress |
Pass, 300±5ºC,10 seconds, 3 cycles.
No delamination, no blistering. |
| Function |
100% Pass electrical test |
| Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
Main flexible PCBs
Disposal prior to Solder mask
Audited Supplier 
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