Immersion Silver PCB Built 0.8mm Fr4 with Double Sided Copper

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-887-V8.87
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
0.8mm
Surface Finish
Immersion Silver, ≥0.15um
out Layer Copper
1 Oz
Soldermask Color
Blue
Silkscreen Color
White
Minimum Trace and Space
No Required
Minimum / Maximum Holes
0.5 mm / 5.0 mm
Via
Minimum Size 0.5mm
Board Plating
0.0029"
Test
100% Electronic Test
Transport Package
Vacuum
Specification
201mm x 56mm =1pcs
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

1.1 General description

This is a type of double sided PCB with immersion silver built on FR-4 substrate with Tg
150°C for the application of Satellite Dish. It's 0.8 mm thick without silkscreen and no solder
mask. The base material is from ITEQ supplying single PCB. They're fabricated per IPC 6012
Class 2 using supplied Gerber data. Each 20 panels are packed for shipment. 

1.2 Features and benifits    

a. Mid Tg FR4 with Outstanding thermal resistance and suitable for lead-free process;
b. Immersion silver, the Environmental-friendly surface treatment, mature technology;
c. Powerful PCB capabilities support your reaearch and development, sales and marketing;
d. 8000 types of PCB per month;
e. More than 15 years of experience;
f.  Coupon policy for new customer;
g. Focus on low to medium volume production

1.3 Application

Wireless Routers, Embedded Systems, Satellite Broadband, USB WiFi Antenna, Remote
Server, Media Access Control, Tracking Devices For Vehicles, PLC Controls, Multi Chip Modules,
Central fire alarm systems
    
1.4 Parameter and data shee
PCB SIZE 201 x 56mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components NO
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
FR-4 IT158 0.8mm
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: N/A
Minimum / Maximum Holes: 0.5 mm / 5.0 mm
Number of Different Holes: 3
Number of Drill Holes: 32
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg150ºC, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  1 oz
Final foil internal:  0 oz
Final height of PCB:  0.8 mm ±0.08
PLATING AND COATING  
Surface Finish Immersion silver, ≥0.15um
Solder Mask Apply To:  NO
Solder Mask Color:  NO
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

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