| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Epoxy Fr-4 Resin/Woven Glass |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
General Description
The TU-872 SLK Sp is a high-performance multilayer printed circuit board (PCB) made from a modified epoxy FR-4 resin. This material is reinforced with advanced woven glass and is engineered to have an exceptionally low dielectric constant and low dissipation factor, making it suitable for high-speed, low-loss, and high-frequency circuit board applications. The TU-872 SLK Sp is compatible with lead-free environmental protection processes and works well with standard FR-4 manufacturing methods. Its laminates demonstrate excellent Coefficient of Thermal Expansion (CTE), superior resistance to chemicals and moisture, thermal stability, and resistance to conductive anodic filament (CAF), enhanced by a unique allyl network forming compound.
Key Features
Excellent Electrical Properties: Ensures optimal performance in various applications.
Dielectric Constant Less Than 3.5: Ideal for high-frequency applications.
Dissipation Factor Less Than 0.010: Minimizes signal loss and improves efficiency.
Stable and Flat Dk/Df Performance: Guarantees consistent performance across the board.
Compatibility with Most FR-4 Processes: Versatile for different manufacturing methods.
Lead-Free Process Compatible: Meets environmental standards.
Improved Z-Axis Thermal Expansion: Enhances reliability under thermal stress.
Anti-CAF Capability: Reduces the risk of conductive failures.
Superior Dimensional Stability, Thickness Uniformity, and Flatness: Ensures high-quality production standards.
Excellent Through-Hole and Soldering Reliability: Ensures durability and performance in assembly.
Our PCB Capabilities (TU-872 SLK Sp)
| Our PCB Capability (TU-872 SLK Sp) | |
| PCB Material: | High performance modified epoxy FR-4 resin |
| Designation: | TU-872 SLK Sp |
| Dielectric constant: | < 3.5 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEIPIG, Pure gold etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Main Applications
Radio Frequency: Used in RF devices for reliable signal transmission.
Backpanel and High-Performance Computing: Ideal for complex computing systems.
Line Cards and Storage: Essential components in data storage solutions.
Servers, Telecom, and Base Stations: Supports critical telecommunications infrastructure.
Office Routers: Provides reliable connectivity solutions.
Our Advantages
Certifications: ISO9001, ISO14001, IATF16949, ISO13485, UL Certified.
Workshop Size: 16,000m2 facility.
Production Capacity: 30,000m2 output capability per month.
Production Capabilities: From prototype to large volume production.
Quality Standards: IPC Class 2 / IPC Class 3 compliant.
HDI PCBs: Capability to produce any layer high-density interconnect PCBs.
On-Time Delivery: Over 98% delivery rate.
Customer Satisfaction: Complaint rate less than 1%.
Typical Properties (TU-872 SLK Sp)
| Typical Properties for TU-872 SLK Sp Laminate | |||
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 220°C | ||
| Tg (DSC) | 200°C | > 170°C | |
| Tg (TMA) | 190°C | E-2/105 | |
| Td (TGA) | 340°C | > 340°C | |
| CTE x-axis | 12~15 ppm/°C | N/A | |
| CTE y-axis | 12~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.30% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | 60 min | > 30 min | |
| T288 | 20 min | E-2/105 | > 15 min |
| T300 | 5 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 3.5 | ||
| Loss Tangent (RC 50%) @10GHz | 0.008 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 3.6/3.4 | < 5.2 | |
| 5GHz (SPC method) | 3.5 | E-2/105 | - |
| 10GHz (SPC method) | 3.5 | - | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.006/0.004 | ||
| 5GHz (SPC method) | 0.007 | E-2/105 | < 0.035 |
| 10GHz (SPC method) | 0.008 | ||
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 kV/mm |
| Dielectric Breakdown | > 50 kV | A | N/A |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 26 GPa | A | N/A |
| Fill Direction | 24 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 4~7 lb/in | A | > 4 lb/in |
| Water Absorption | 0.13% | E-1/105+D-24/23 | < 0.5 % |
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