4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Tu-872
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  • 4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
  • 4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
  • 4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
  • 4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
  • 4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
  • 4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
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Basic Info.

Model NO.
BIC-501-V3.0
Material
Tu-872 Slk Sp Laminate
Application
RF Devices
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Immersion Gold
Base Material
Tu-872 Slk Sp Laminate
Insulation Materials
Woven Glass Reinforced Epoxy Composite
Brand
Tuc
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, Pcbdoc etc
Service Area
Worldwide, Globally
Transport Package
Vacuum Packed Shipment
Specification
400× 500mm
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Brief Introduction

The 4-layer TU-872 HDI PCB is constructed from low dielectric constant/dissipation factor (DK/DF) FR-4 material, specifically the TU-872 SLK Sp. This PCB is designed with four copper layers, each measuring 1 oz, and features a coating of immersion gold along with a green solder mask. The final thickness of the PCB is 1.6mm ± 10%. Each panel consists of 16 pieces and incorporates a high-density interconnect (HDI) configuration, which includes blind vias from the top side to inner layer 1 and buried vias connecting inner layer 1 to inner layer 2. These boards are fabricated according to IPC-Class-2 standards and are vacuum packed for shipment.
 

Typical Applications

1.Radio Frequency: Suitable for RF applications where signal integrity is crucial.
2.Backpanel and High-Performance Computing: Ideal for advanced computing systems.
3.Line Cards and Storage: Essential for data storage devices and line cards.
4.Servers, Telecom, and Base Stations: Supports vital telecommunications equipment.
5.Office Routers: Provides reliable connectivity for office environments.

4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias


 

 

PCB Specifications

Item  Description  Requirement Actual Result
1. Laminate           Material Type  FR-4 TU-872 SLK Sp FR-4 TU-872 SLK Sp ACC
Tg 170ºC 170ºC ACC
Supplier TU TU ACC
Thickness 1.6±10% mm 1.61-1.62mm ACC
2.Plating thickness       Hole Wall 25µm 26.51µm ACC
Outer copper 35µm 40.21µm ACC
Inner Copper 30µm 31.15µm ACC
3.Solder mask                   Material Type Kuangshun Kuangshun ACC
Color  Green Green ACC
Rigidity (Pencil Test) 4H or above 5H ACC
S/M Thickness 10 µm 19.55µm ACC
Location Both Sides Both Sides ACC
4. Component Mark    Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S, S/S C/S, S/S ACC
5. Vias  Therough holes YES L1-L4 ACC
Blind vias YES L1-L2 ACC
Buried vias YES L2-L3 ACC
6. Identification        UL Mark  YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness      
Nickel Thickness 3-6µm 5.27µm ACC
Gold Thickness 0.05µm 0.065µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring  Min. Line Width (mil) 7mil 6.8mil ACC
Min. Spacing (mil) 6mil 6.2mil ACC
10.V-groove  Angle 30±5º 30º ACC
Residual thickness 0.4±0.1mm 0.38mm ACC
11. Beveling  Angle      
Height      
12. Function                 Electrical Test 100% PASS 100% PASS ACC
13. Appearance     IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist <=0.7% 0.32% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5ºC OK ACC
Thermal Stress Test 288 ±5ºC OK ACC
Ionic Contamination Test <= 1.56 µg/cm2 0.58µg/cm2 ACC

 


 

High Tg PCB

The thermal properties of the resin system are defined by the glass transition temperature (Tg), measured in degrees Celsius (°C). The Tg indicates the temperature at which the material transitions from a rigid, glassy state to a soft, rubbery state. For common epoxy resins (FR-4 grade), the Tg typically ranges from 115 to 130°C. Exceeding this temperature during soldering can cause the PCB to expand in the Z-axis direction, which may stress the copper walls of plated-through holes. The thermal expansion of epoxy resin is approximately 15 to 20 times greater than that of copper above Tg, leading to a risk of cracking in the hole walls. Below Tg, the expansion ratio is only three times, significantly reducing the risk of cracking.

 

PCBs with a Tg of 170°C or higher are classified as high Tg PCBs, while those with a Tg above 130°C are generally considered standard.
 

Partial High Tg Material in House
 

Material

Tg (ºC)

Manufacturer

S1000-2M

180

Shengyi

TU-768

170

TU

TU-872 SLK Sp

170

TU

TU-883

170

TU

IT-180ATC

175

ITEQ

KB-6167F

170

KB

M6

185

Panasonic

Kappa 438

280

Rogers

RO4350B

280

Rogers

RO4003C

280

Rogers

RO4730G3

280

Rogers

RO4360G2

280

Rogers

 
4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias
4-Layer PCB Tu-872 HDI Printed Circuit Board Featuring Blind Vias/Buried Vias

 

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