| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Fr-4 Tg170ºC Substrate |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
General Description
This 14-layer HDI printed circuit board is constructed on an FR-4 Tg170 substrate, designed for codec equipment applications. It has a thickness of 2.0 mm, features a white silkscreen on a green solder mask, and utilizes immersion gold on the pads. The PCB includes high-density interconnection layers with blind vias connecting L1-L2, L13-L14, and buried vias connecting L3-L4, L4-L12, and L12-L13. Microvias are stacked across different layers. The base material is sourced from ITEQ, with one board per panel. The PCBs are manufactured according to IPC 6012 Class 2 standards using the provided Gerber data, with each shipment containing 20 panels.
Our Advantages
1.ISO9001, ISO14001, IATF16949, UL Certified
2.Prototype to volume production capabilityB
3.16,000m2 workshop
4.30,000m2 output capacity per month
5.8,000 types of PCBs produced monthly
6.IPC Class 2 / IPC Class 3 compliance
7.First production eligible products rate: >95%
Applications of HDI PCBs
Automotive
GPS Trackers
5G WiFi
Embedded Systems
Smartphones and Tablets
Wearable Technology and Healthcare
Access Control Solutions
Aerospace
Parameter and Data Sheet
| Number of Layers | 14-Layer |
| Board Type | Multilayer PCB |
| Board size | 220mm x 170mm=4PCS |
| Board Thickness | 2.0 mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170ºC |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 18 um (0.5oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAIYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 5.8 mil |
| Minimum Gap(mil) | 6.2 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Vias | Blind vias L1-L2, L13-L14, buried vias L3-L4, L4-L12, and L12-L13, Through holes. |
| Thermal Shock Test | Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
Different Types of HDI PCBs
To simplify the classification of high-density interconnect PCBs, we define three types of HDI PCBs as follows:
1+N+1: PCBs that contain one-time laser drilling and pressing.
I+N+I (I≥2): PCBs that include two or more laser drilling and pressing steps, featuring staggered or stacked microvias across different layers.
Any Layer HDI: Blind and buried vias can be placed freely on various layers as per the designer's requirements.
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