| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Tu-768/Woven E-Glass with High-Tg Epoxy Resin |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Brief Introduction
The TU-768 and TU-768P laminates/prepregs are constructed from high-quality woven E-glass coated with an epoxy resin system. This design endows the laminates with UV-blocking characteristics and ensures compatibility with automated optical inspection (AOI) processes. These products are specifically designed for applications that require resilience to severe thermal cycles and high assembly work. TU-768 laminates demonstrate excellent Coefficient of Thermal Expansion (CTE), superior chemical resistance, thermal stability, and CAF resistance.
Key Features
Lead-Free Process Compatible: Meets environmental standards.
Excellent Coefficient of Thermal Expansion: Ensures dimensional stability.
Anti-CAF Property: Reduces the risk of conductive anodic filament failures.
Superior Chemical and Thermal Resistance: Enhances longevity and reliability.
Fluorescence for AOI: Facilitates effective automated inspection.
Moisture Resistance: Protects against environmental factors.
Main Applications
Consumer Electronics: Ideal for devices requiring high durability.
Servers and Workstations: Suited for high-performance computing environments.
Automotive: Designed to meet the rigorous demands of automotive applications.
Our PCB Capability (TU-768)
| Our PCB Capability (TU-768) | |
| PCB Material: | High-Tg and High Thermal Reliability Epoxy Resin |
| Designation: | TU-768 |
| Dielectric constant: | 4.3 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEPIG, Pure gold etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Typical Properties of TU-768
| Typical Properties for TU-768 Laminate | |||
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 190°C | ||
| Tg (DSC) | 180°C | > 170°C | |
| Tg (TMA) | 170°C | E-2/105 | |
| Td (TGA) | 350°C | > 340°C | |
| CTE x-axis | 11~15 ppm/°C | N/A | |
| CTE y-axis | 11~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.70% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | > 60 min | > 30 min | |
| T288 | > 20 min | E-2/105 | > 15 min |
| T300 | > 2 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 4.3 | ||
| Loss Tangent (RC 50%) @10GHz | 0.018 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 4.4 / 4.3 | < 5.2 | |
| 5GHz (SPC method) | 4.3 | E-2/105 | N/A |
| 10GHz (SPC method) | 4.3 | N/A | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.019 /0.018 | < 0.035 | |
| 5GHz (SPC method) | 0.021 | E-2/105 | N/A |
| 10GHz (SPC method) | 0.023 | N/A | |
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 KV/mm |
| Dielectric Breakdown | > 50 kV | A | > 40 KV |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 25 GPa | A | N/A |
| Fill Direction | 22 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 7~9 lb/in | A | > 4 lb/in |
| Water Absorption | 0.18% | E-1/105+D-24/23 | < 0.8 % |
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