| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | High-Performance Resin + Woven E-Glass Reinforcem |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
General Description
ThunderClad 2 (TU-883) is a very low loss printed circuit board material made from high-performance resin. This material is reinforced with standard woven E-glass and features a low dielectric constant and dissipation factor resin system, making it ideal for high-speed, low-loss, radio frequency, and wireless applications. TU-883 is compatible with lead-free processes and can also be used in FR-4 processes. The laminates offer excellent moisture resistance, improved Coefficient of Thermal Expansion (CTE), superior chemical resistance, thermal stability, and CAF resistance.
Features & Benefits
Excellent Electrical Properties: Optimized for high-frequency applications.
Dielectric Constant: Less than 4.0.
Dissipation Factor: Less than 0.005.
Stable Dk/Df Performance: Consistent over varying frequencies and temperatures.
FR-4 Compatible: Works well with modified FR-4 manufacturing processes.
Moisture Resistance: Suitable for environments requiring high durability.
Lead-Free Reflow Process Compatible: Supports eco-friendly manufacturing.
Improved Z-Axis Thermal Expansion: Enhances dimensional stability.
Anti-CAF Capability: Reduces the risk of conductive anodic filament failures.
Excellent Through-Hole and Soldering Reliability: Ensures durability in assembly.
Halogen Free: Complies with environmental standards.
Applications
Radio Frequency: Ideal for RF applications.
Backplane: Suitable for high-performance computing environments.
Line Cards: Designed for efficient data handling.
Storage Solutions: Optimized for storage systems.
Servers: Supports high-demand server applications.
Telecommunications: Essential for telecommunication infrastructure.
Base Stations: Suitable for mobile network base stations.
Office Routers: Ideal for routing solutions in office settings.
Typical Properties of TU-883
| Typical Values | Test Condition | SPEC | |
| Thermal | |||
| Tg (DMA) | 220 °C | ||
| Tg (TMA) | 170 °C | E-2/105+des | N/A |
| Td (TGA) | 420 °C | ||
| CTE z-axis α1 | 35 ppm/°C | Pre-Tg | < 60 ppm/°C |
| CTE z-axis α2 | 240 ppm/°C | Post-Tg | < 300 ppm/°C |
| CTE z-axis | 2.50% | 50 to 260°C | < 3.0% |
| Thermal Stress, Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T-260 | > 60 min | > 30 min | |
| T-288 | > 60 min | E-2/105+des | > 15 min |
| T-300 | > 60 min | ||
| Flammability | 94V-0 | E-24/125+des | 94V-0 |
| Electrical | |||
| Permittivity (RC63%) | |||
| 1GHz (SPC method) | 3.60 | ||
| 5GHz (SPC method) | 3.58 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 3.57 | ||
| Loss Tangent (RC63%) | |||
| 1GHz (SPC method) | 0.0030 | ||
| 5GHz (SPC method) | 0.0037 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 0.0046 | ||
| Volume Resistivity | > 1010 M•cm | C-96/35/90 | > 106 M•cm |
| Surface Resistivity | > 108 M | C-96/35/90 | > 104 M |
| Electric Strength | > 40 KV/mm | - | > 30 KV/mm |
| Dielectric Breakdown Voltage | > 50 KV | - | > 40 KV |
| Mechanical | |||
| Young's Modulus | |||
| Warp Direction | 28 GPa | A | N/A |
| Fill Direction | 26 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz. Cu foil | 4~6 lb/in | A | > 4 lb/in |
| Water Absorption | 0.08% | E-1/105+des+D-24/23 | < 0.8 % |
| Our PCB Capability (TU-883) | |
| PCB Material: | High Temperature Resin |
| Designation: | TU-883 |
| Dielectric constant: | 3.60 at 1GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEPIG, Pure gold etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
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