Multilayer PCB Built on Fr4 with 6 Layer Copper Layer

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-893-V8.93
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
1.6mm
Surface Finish
HASL Lead Free
out Layer Copper
1 Oz
Soldermask Color
Green
Silkscreen Color
White
Minimum Trace and Space
4 Mil / 4 Mil
Minimum / Maximum Holes
0.3/4.22mm
Final Foil Internal
1 Oz
Via
Minimum Size 0.3mm
Test
100% Electronic Test
Transport Package
Vacuum
Specification
135mm x 91mm =2pcs
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534001000
Production Capacity
50000 PCS/ Month

Product Description

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of
Fiber optic receptors. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo)
and HASL on pads. The base material is from ITEQ supplying 2 up PCBs per panel. They're
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for
shipment. 

1.2 Features and benifits    
    
a. It's suitable for handheld and consumer applications. 
b. Excellent wetting during component soldering and it can avoid copper corrosion.
c. Shortened connection between electronic components
d. Right manufacturing instruction (MI)
e. Delivery on time. Higher than 98% on-time-delivery rate.
f.  12 hours quotation
g. No MOQ, low cost for prototypes and small runs quantity. 

1.3 Application

GPS Tracking Device, USB Wireless Adapter, Electrical Transformers, Wireless Router
Reviews, USB Modems, Battery Inverter, Modem Router 3G, Wireless G Router, Game
Player, Amplifiers        

1.4 Parameter and data sheet
PCB SIZE 135 x 91mm=2PCS
BOARD TYPE Multilayer PCB
Number of Layers 6 layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP Top layer --- 18um +plating
PP 200um dielectric
Layer 2 GND --- 35um copper
PP 300um dielectric
Layer 3 PWR --- 35um copper
Core FR-4 360um
Layer 4 PWR --- 35um copper
PP 300um dielectric
Layer 5 GND --- 35um copper
PP 200um dielectric
Bottom layer --- 18um +plating
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3/4.22mm
Number of Different Holes: 7
Number of Drill Holes: 611
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: 0
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg150ºC, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish HASL Lead free
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300
Manufacturer Name or Logo:  Marked on the board in a conductor 
and leged FREE AREA
VIA plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

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