Taconic Tlx-0, Tlx-9, Tlx-8, Tlx-7 and Tlx-6 High Frequency PCB with HASL, Immersion Gold, Silver, Tin and OSP

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tlx
• Model NO.: BIC-101-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Taconic
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Taconic TLX-0, TLX-9, TLX-8, TLX-7 and TLX-6 High Frequency PCB with HASL, Immersion Gold, Silver, Tin and OSP
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,
Today, we're going to talk about TLX high frequency PCB.

TLX is a series of PTFE fiberglass laminates launched by Taconic Company. It offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range. It is suitable for low layer count microwave PCBs.

Let's firstly see the advantages that we benefit from.
1. Dimensionally stable:
It can experience high level of vibration, such as space launch.

2. Excellent thermal properties:
It can experience high temperature exposure, such as working in engine modules.

3. Low and stable dielectric constant and tightly controlled DK.
   Ranging 2.45 to 2.65 at tolerance +/-0.04

4. Low moisture absorption
   Undergoing extreme severe environments, such as working at sea
5. Flame retardant grade, UL 94 VO
6. Low DF


TLX is ideal material for use in the application of following list due to its wide DK range and available thickness and copper cladding.
1. Radar systems,
2. Mobile communications,
3. Microwave test equipment,
4. Microwave transmission devices,
5. Antennas,
6. Mixers, splitters, filters and combiners

There're TLX-0, TLX-9, TLX-8, TLX-7 and TLX-6 in TLX family. Often it's used in single layer board, double layer board etc. Surface finish is mainly with bare copper, hot air level and immersion gold.

Our PCB Capability (TLX)

PCB Material:	PTFE Fiberglass
TLX Family (Dielectric constant ±0.04)	TLX-0 (DK=2.45)
	TLX-9 (DK=2.50)
	TLX-8 (DK=2.55)
	TLX-7 (DK=2.60)
	TLX-6 (DK=2.65)
Layer count:	1 Layer, 2 Layer, 4 Layer.
Copper weight:	0.5oz, 1oz, 2oz
PCB thickness:	0.5mm, 0.8mm, 1.0mm,
	1.5mm,  3.2mm
PCB Size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin etc.

The basic colour of TLX high frequency PCB is brown and black.

We specialize in providing you with prototype, small batches and mass production service.
If you have any requirements on this kind of PCB, please feel free to contact us.
Thank you for your reading.

Appendix: Data Sheet of TLX-8

TLX-8 TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK @10 GHz	IPC-650 2.5.5.3		2.55		2.55
Df @1.9 GHz	IPC-650 2.5.5.5.1		0.0012		0.0012
Df @10 GHz	IPC-650 2.5.5.5.1		0.0017		0.0017
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Flexural Strength(MD)	ASTM D 709	psi	28,900	N/mm^2
Flexural Strength(CD)	ASTM D 709	psi	20,600	N/mm^2
Tensile Strength(MD)	ASTM D 902	psi	35,600	N/mm^2
Tensile Strength(CD)	ASTM D 902	psi	27,500	N/mm^2
Elongation at Break(MD)	ASTM D 902	%	3.94	%	3.94
Elongation at Break(CD)	ASTM D 902	%	3.92	%	3.92
Young's Modulus(MD)	ASTM D 902	kpsi	980	N/mm^2
Young's Modulus(CD)	ASTM D 902	kpsi	1,200	N/mm^2
Young's Modulus(MD)	ASTM D 3039	kpsi	1,630	N/mm^2
Poisson's Ratio	ASTM D 3039		0.135	N/mm
Peel Stength(1 oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	15	N/mm
Peel Stength(1 oz.RTF)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	17	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8.3(Elevated Temp.)	Ibs./linear inch	14	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	11	N/mm
Peel Stength(1 oz.rolled)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	13	N/mm	2.1
Thermal Conductivity	ASTM F433/ASTM 1530-06	W/M*K	0.19	W/M*K	0.19
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(After Bake.)	mils/in.	0.06	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.4(After Bake.)	mils/in.	0.08	mm/M
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.09	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.1	mm/M
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm	6.605 x 10^8	Mohm	6.605 x 10^8
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm	3.550 x 10^6	Mohm	3.550 x 10^6
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm/cm	1.110 x 10^10	Mohm/cm	1.110 x 10^10
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm/cm	1.046 x 10^10	Mohm/cm	1.046 x 10^10
CTE(X axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	21	ppm/ºC	21
CTE(Y axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	23	ppm/ºC	23
CTE(Z axis)(25-260ºC)	IPC-650 2.4.41/ASTM D 3386	ppm/ºC	215	ppm/ºC	215
Density(Specific Gravity)	ASTM D 792	g/cm^3	2.25	g/cm^3	2.25
Td(2% Weight Loss)	IPC-650 2.4.24.6(TGA)	ºC	535	ºC
Td(5% Weight Loss)	IPC-650 2.4.24.6(TGA)	ºC	553	ºC
Flammability Rating	UL-94		V-0		V-0

Thank you for your reading and you're welcome to contact us for your PCB enquiries.